深度包检测设备技术要求
Technical Requirements of Deep Packet Inspection Device
2009-06-15
YD/T 2931-2015
基于分离架构的深度包检测系统技术要求 独立式流量采集设备
Technical requirements for deep packet inspection system based on separation architecture-Independent traffic collection device
2015-07-14
BS IEC 63068-2-2019
Semiconductor devices. Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices-Test method for defects using optical inspection
半导体器件 功率器件用碳化硅同质外延片缺陷的无损识别准则
2019-02-08
YY/T 0681.11-2014
无菌医疗器械包装试验方法 第11部分：目力检测医用包装密封完整性
Test methods for sterile medical device package—Part 11:Determining integrity of seals for medical packaging by visual inspection
2014-06-17
KS C IEC 63068-2
반도체 소자 — 전력 소자용 탄화규소 호모에피택셜 웨이퍼의 결함에 대한 비파괴 인식 기준 — 제2부: 광학 검사를 사용한 결함 검사 방법
半导体器件 功率器件用碳化硅同质外延晶片缺陷的无损识别准则 第2部分:用光学检查法检测缺陷的试验方法
2025-01-31
GB/T 43493.2-2023
半导体器件 功率器件用碳化硅同质外延片缺陷的无损检测识别判据 第2部分：缺陷的光学检测方法
Semiconductor device—Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices—Part 2: Test method for defects using optical inspection
2023-12-28
IEC 63068-2-2019
Semiconductor devices – Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 2: Test method for defects using optical inspection
半导体器件.功率器件用碳化硅同质外延片中缺陷的无损识别标准.第2部分:光学检验缺陷的试验方法
2019-01-30
DIN EN 61747-5-2
Liquid crystal display devices - Part 5-2: Environmental, endurance and mechanical test methods - Visual inspection of active matrix colour liquid crystal display modules (IEC 61747-5-2:2011); German version EN 61747-5-2:2011
液晶显示器件.第5-2部分:环境、耐久性和机械试验方法.有源矩阵彩色液晶显示模块的目视检查（IEC 61747-5-2-2011）；德文版EN 61747-5-2:2011