KS D 8545
수지 플럭스 코어 무연 연납
树脂药芯焊丝无铅焊料
2018-12-17
KS D 8545(2023 Confirm)
수지 플럭스 코어 무연 연납
树脂药芯无铅焊料
2018-12-17
GB/T 20422-2018
无铅钎料
Lead-free solders
2018-05-14
SJ/T 11697-2018
无铅元器件焊接工艺适应性规范
Applicability specification of soldering process for lead free component
2018-02-09
JB/T 6173-2014
免清洗无铅助焊剂
Fluxes for no-clean and lead-free
2014-05-12
ASM Sn-13
INDALLOY 227 - Lead-Free Solder
IND合金227-无铅焊料
1998-01-01
YS/T 747-2010
无铅锡基焊料
Lead-free tin-based solder
2010-11-22
IPC J-STD-006B
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
电子焊接用电子级焊料合金、助焊剂和非助焊剂的要求
2006-01-01
SAE USCAR40-2
Lead-Free Solder Validation Test Plan
无铅焊接验证测试计划
2020-11-19
JB/T 10845-2008
无铅再流焊接通用工艺规范
General technological specification for lead-free reflow soldering
2008-02-01
BS PD IEC/TS 62647-3-2014
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder-Performance testing for systems containing lead-free solder and finishes
航空电子设备的过程管理 含无铅焊料的航空航天和国防电子系统
2014-03-31
SAE GEIASTD0005_1B
Standard for Developing a Lead-Free Control Plan to Manage the Risks of Lead-Free Solders and Finishes in Aerospace, Defense, and High-Performance Soldered Electronic Products
制定无铅控制计划以管理航空航天、国防和高性能焊接电子产品中无铅焊料和表面处理的风险的标准
2023-08-01
KS D 8546
무연 연납 — 화학 조성과 형상
无铅软钎料合金 化学组成和形态
2018-12-17
KS D 8546(2023 Confirm)
무연 연납 — 화학 조성과 형상
无铅软焊料合金.化学成分和形式
2018-12-17
JIS Z 3198-6-2003
Test methods for lead-free solders -- Part 6: Methods for 45�pull test of solder joints on QFP lead
无铅焊料试验方法第6部分:QFP铅焊点45°拉力试验方法
2003-01-01
GOST R 59681-2021
Сборка и монтаж электронных модулей. Припои, флюсы для пайки, припойные пасты. Марки, состав, свойства и область применения
组装和安装电子模块 焊料、助焊剂、焊膏 其类型、组成、性质及应用
GB/T 41275.3-2022
航空电子过程管理 含无铅焊料航空航天及国防电子系统 第3部分：含无铅焊料和无铅管脚的系统性能试验方法
Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 3：Performance testing for systems containing lead-free solder and finishes
2022-03-09
IEC TS 62647-3-2014
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes
航空电子设备的过程管理.含无铅焊料的航空航天和国防电子系统.第3部分:含无铅焊料和饰面的系统的性能试验
2014-02-25
BS PD IEC/TS 62647-1-2012
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder-Preparation for a lead-free control plan
航空电子设备的过程管理 含无铅焊料的航空航天和国防电子系统
2012-11-30
KS C IEC 61190-1-3(2016 Confirm)
전자 조립품용 부착 재료－제1－3부：전자 납땜 응용에 사용하는 전자등급 땜납합금과 플럭스 및 비플럭스 고형 땜납의 요구사항
电子组装用连接材料第1－3部分:电子焊接用电子级焊料合金及助熔剂和非助熔剂固体焊料的要求
2006-12-18