IPC J-STD-006B
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
电子焊接用电子级焊料合金、助焊剂和非助焊剂的要求
2006-01-01
GOST R 59681-2021
Сборка и монтаж электронных модулей. Припои, флюсы для пайки, припойные пасты. Марки, состав, свойства и область применения
组装和安装电子模块 焊料、助焊剂、焊膏 其类型、组成、性质及应用
EIA 534
Ceramic Capacitor Applications Guide Soldering and Solderability Maintenance of Leaded Electronic Components
陶瓷电容器应用指南铅电子元件的焊接和可焊性维护
1989-01-01
KS C IEC 61190-1-3(2016 Confirm)
전자 조립품용 부착 재료－제1－3부：전자 납땜 응용에 사용하는 전자등급 땜납합금과 플럭스 및 비플럭스 고형 땜납의 요구사항
电子组装用连接材料第1－3部分:电子焊接用电子级焊料合金及助熔剂和非助熔剂固体焊料的要求
2006-12-18
KS C IEC 61190-1-3
전자부품 조립용 부착 재료 —제1-3부: 전자부품 솔더링 시 사용하는 전자등급 솔더 합금과 플럭스 및 비플럭스 고체 솔더의 요구사항
电子组装用连接材料.第1-3部分:电子焊接用电子级焊料合金和助焊剂和非助焊剂固体焊料的要求
2021-12-02
IEC 61190-1-3-2017
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
电子组装用附件材料 - 第1-3部分:电子级焊料合金以及用于电子焊接应用的助焊剂和非助焊剂固体焊剂的要求
2017-12-13
GB/T 29089-2012
球形焊锡粉
Spherical tin-solder powder
2012-12-31
EIA 186-9E
Electronics - Part 9: Solderability
电子学第9部分:可焊性
1978-10-01
BS EN 60512-12-2-2006
Connectors for electronic equipment. Tests and measurements-Soldering tests. Test 12b. Solderability, wetting, soldering iron method
电子设备用连接器 测试和测量 焊接测试 测试12b 可焊性、润湿性、烙铁法
2007-03-30
BS EN 60512-12-1-2006
Connectors for electronic equipment. Tests and measurements-Soldering tests-Test 12a. Solderability, wetting, solder bath method
电子设备用连接器 测试和测量
2006-06-30
BS EN 60512-12-3-2006
Connectors for electronic equipment. Tests and measurements-Soldering tests-Solderability, de-wetting
电子设备用连接器 测试和测量
2007-03-30
BS EN 60512-12-5-2006
Connectors for electronic equipment. Tests and measurements-Soldering tests. Test 12e. Resistance to soldering heat, soldering iron method
电子设备用连接器 测试和测量 焊接测试 测试12e 耐焊接热 烙铁法
2006-04-28
BS EN 60512-12-4-2006
Connectors for electronic equipment. Tests and measurements-Soldering tests. Test 12d. Resistance to soldering heat, solder bath method
电子设备用连接器 测试和测量 焊接测试 测试12d 耐焊接热 锡槽法
2007-03-12
KS C IEC 61192-5(2017 Confirm)
납땜된 전자조립품에 대한 작업 요구사항－제5부：납땜된 전자조립품의 재작업,보정 및 수리
焊接电子组件工艺要求第5部分:焊接电子组件的返工、修改和修理
2012-11-19
KS C IEC 61192-5(2022 Confirm)
납땜된 전자조립품에 대한 작업 요구사항－제5부：납땜된 전자조립품의 재작업,보정 및 수리
焊接电子组件的工艺要求第5部分:焊接电子组件返工、修改和修理
2012-11-19
IPC J-STD-001H
Requirements for Soldered Electrical and Electronic Assemblies
焊接电气和电子组件的要求
2020-09-01
BS EN 61192-5-2007
Workmanship requirements for soldered electric assemblies-Rework, modification and repair of soldered electronic assemblies
焊接电气组件的工艺要求
2007-07-31
IEC 60512-12-1-2006
Connectors for electronic equipment - Tests and measurements - Part 12-1: Soldering tests - Test 12a: Solderability, wetting, solder bath method
电子设备连接器 - 测试和测量 - 第12-1部分:焊接测试 - 测试12a:可焊性 润湿 焊锡方法
2006-03-23
IEC 60512-12-2-2006
Connectors for electronic equipment - Tests and measurements - Part 12-2: Soldering tests - Test 12b: Solderability, wetting, soldering iron method
电子设备连接器 - 测试和测量 - 第12-2部分:焊接测试 - 测试12b:可焊性 润湿 焊接铁法
2006-02-13
IEC 60512-12-4-2006
Connectors for electronic equipment - Tests and measurements - Part 12-4: Soldering tests - Test 12d: Resistance to soldering heat, solder bath method
电子设备连接器 - 测试和测量 - 第12-4部分:焊接测试 - 测试12d:耐焊接热 焊锡法
2006-02-13