JC/T 597-2011
半导体用透明石英玻璃管
Transparent quartz glass tubes for semiconductor
2011-12-20
JC/T 2064-2011
半导体用透明石英玻璃棒
Transparent quartz glass rods for semiconductor
2011-12-20
JC/T 755-1996
半导体用透明石英玻璃管
Transparent quartz glass tubes for semiconductor technology
1988-06-30
JC/T 225-2012
液位计用透明石英玻璃管
Transparent quartz glass tubes for liquid gauge
2012-12-28
JC/T 750-2014
透明石英玻璃抗析晶性试验方法
Test method for anti-devitrification of transparent quartz glass
2014-05-06
JC/T 7-1996
光源及真空仪表用透明石英玻璃管
Transparent quartz glass tubes for light sources and vacuum instrument
1988-06-30
GB/T 5949-2014
透明石英玻璃气泡、气线试验方法
Test method for bubble and air line of transparent quartz glass
2014-07-24
JB/T 8320-1996
电力半导体器件工艺用涂层石英玻璃管
Coated quartz glass tubes intended to be used in the production process of power semiconductor devices
1996-04-11
GOST 19908-1990
Тигли, чаши, стаканы, колбы, воронки, пробирки и наконечники из прозрачного кварцевого стекла. Общие технические условия
透明石英玻璃坩埚 盆 杯 烧瓶 漏斗 试管和盖子 一般规格
BS EN 62047-15-2015
Semiconductor devices. Micro-electromechanical devices-Test method of bonding strength between PDMS and glass
半导体器件 微机电设备
2015-07-31
BS EN 60191-6-8-2001
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Design guide for glass sealed ceramic quad flatpack (G-QFP)
半导体器件的机械标准化 表面安装半导体器件封装外形图绘制通则
2001-11-16
BS IEC 62047-27-2017
Semiconductor devices. Micro-electromechanical devices-Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
半导体器件 微机电设备
2020-07-22
SJ 50033/144-1999
半导体分立器件 2CW50～78型玻璃钝化封装硅电压调整二极管详细规范
Semiconductor discrete devices Detail specification for types 2CW50～78 glass passivation package Silicon voltage-regulator diodes
1999-11-10
IEC 62047-27-2017
Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
半导体器件 - 微机电器件 - 第27部分:使用微人造橡胶试验（MCT）的玻璃料接合结构的结合强度试验
2017-01-20
UNE-EN 60191-6-8-2002
Mechanical standardization of semiconductor devices -- Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP).
半导体器件的机械标准化第6-8部分:表面安装半导体器件封装外形图绘制的一般规则玻璃密封陶瓷四边形扁平封装（G-QFP）的设计指南
2002-06-28
IEC 60191-6-8-2001
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
半导体器件的机械标准化.第6-8部分:表面安装半导体器件封装外形图绘制的一般规则.玻璃密封陶瓷方形扁平封装（G-QFP）的设计指南
2001-08-27
DIN EN 62047-15
Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass (IEC 62047-15:2015); German version EN 62047-15:2015
半导体器件.微机电器件.第15部分:PDM和玻璃之间结合强度的试验方法（IEC 62047-15-2015）；德文版EN 62047-15:2015
2016-01-01
DIN EN 62047-27-DRAFT
Draft Document - Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT) (IEC 47F/216/CD:2015)
文件草案-半导体器件-微机电器件-第27部分:使用微型V形试验（MCT）的玻璃熔块粘结结构的粘结强度试验（IEC 47F/216/CD:2015）
2015-08-01
DIN EN 60191-6-8
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP) (IEC 60191-6-8:2001); German version EN 60191-6-8:2001
半导体器件的机械标准化.第6-8部分:表面安装半导体器件封装外形图绘制的一般规则；玻璃密封陶瓷四边形扁平封装（G-QFP）的设计指南（IEC 60191-6-8-2001）；德文版EN 60191-6-8:2001
2002-05-01
MIL MIL-S-19500/533D Amendment 1
SEMICONDUCTOR DEVICE, DIODE, SILICON, ZENER, VOLTAGE REGULATOR, SOLID GLASS NONCAVITY CONSTRUCTION, TYPES 1N6309 THROUGH 1N6355; 1N6309US THROUGH 1N6336US; PLUS C AND D TOLERANCE SUFFIX (SUPERSEDING MIL-S-19500/533C) (S/S BY MIL-PRF-19500/533E)
半导体器件、二极管、硅、齐纳、稳压器、固态玻璃非空腔结构 1N6309至1N6355型；1N6309US至1N6336US；加上C和D公差后缀（取代MIL-S-19500/533C）（由MIL-PRF-19500/533E取代S/S）
1994-04-15