Semiconductor devices - Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits
半导体器件.第16-10部分:单片微波集成电路的技术批准表（TAS）
2004-07-15
DIN EN 60747-16-10
Semiconductor devices - Part 16-10: Technology Approval Schedule (TAS) for monolithic microwave integrated circuits (IEC 60747-16-10:2004); German version EN 60747-16-10:2004
半导体器件.第16-10部分:单片微波集成电路的技术批准计划（TAS）（IEC 60747-16-10-2004）；德文版EN 60747-16-10:2004
2005-03-01
EU 172-2019
Commission Delegated Directive (EU) 2019/172 of 16 November 2018 amending, for the purposes of adapting to scientific and technical progress, Annex III to Directive 2011/65/EU of the European Parliament and of the Council as regards an exemption for lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages (Text with EEA relevance.)
2018年11月16日委员会授权指令（EU）2019/172修订 以适应科学技术进步 欧洲议会和理事会指令2011/65/EU附件三 关于豁免焊料中的铅 以完成集成电路倒装芯片封装内半导体芯片和载体之间的可行电气连接（与EEA相关的文本）