BS ISO 18947-1-2021
Imaging materials and prints. Abrasion resistance-General rub testing methods
影像材料和印刷品 耐磨性
2021-11-17
BS EN 61189-5-1-2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies-General test methods for materials and assemblies. Guidance for printed board assemblies
电气材料、印制板和其他互连结构和组件的试验方法
2016-10-31
BS IEC 61189-5-2-2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering flux for printed board assemblies
电气材料、印制板和其他互连结构和组件的试验方法 材料和组件的一般试验方法 印制板组件用助焊剂
2015-01-31
BS EN 61189-5-2-2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies-General test methods for materials and assemblies. Soldering flux for printed board assemblies
电气材料、印制板和其他互连结构和组件的试验方法 材料和组件的一般试验方法 印制板组件用助焊剂
2015-04-30
BS EN 61189-5-3-2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies-General test methods for materials and assemblies. Soldering paste for printed board assemblies
电气材料、印制板和其他互连结构和组件的试验方法 材料和组件的一般试验方法 印制板组件用焊膏
2015-04-30
BS IEC 61189-5-3-2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering paste for printed board assemblies
电气材料、印制板和其他互连结构和组件的试验方法 材料和组件的一般试验方法 印制板组件用焊膏
2015-01-31
BS ISO 18949-2019
Imaging materials. Reflection colour photographic prints. Method for testing stability under low humidity conditions
成像材料 反射彩色照片 低湿度条件下稳定性试验方法
2019-07-24
ISO 18949-2019
Imaging materials — Reflection colour photographic prints — Method for testing stability under low humidity conditions
成像材料.反射彩色照相版画.低湿度条件下稳定性试验方法
2019-07-19
IEC 61189-5-1-2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
电气材料 印刷电路板和其他互连结构和组件的测试方法 - 第5-1部分:材料和组件的一般测试方法 - 印刷电路板组件的指导
2016-07-05
ISO 18951-1-2022
Imaging materials — Scratch resistance of photographic prints — Part 1: General test method
成像材料.照相印刷品的耐刮擦性.第1部分:一般试验方法
2022-11-22
ISO 18947-1-2021
Imaging materials and prints — Abrasion resistance — Part 1: General rub testing methods
成像材料和印刷品.耐磨性.第1部分:一般摩擦试验方法
2021-11-05
BS EN 61189-1-1997
Test methods for electrical materials, printed boards and other interconnection structures and assemblies-General test methods and methodology
电气材料、印制板和其他互连结构和组件的试验方法 一般试验方法和方法
2002-06-21
KS C IEC 61189-5-2
전기재료, 인쇄기판 및 다른 상호접속용 구조 및 조립품에 대한 시험방법 — 제5-2부: 재료 및 조립에 대한 일반 시험방법 — 인쇄기판 조립을 위한 땜질 플럭스
电气材料、印制板和其他互连结构和组件的试验方法.第5-2部分:材料和组件的一般试验方法.印制板组件用助焊剂
2023-06-30
KS C IEC 61189-5-3
전기재료, 인쇄기판 및 다른 상호접속용 구조 및 조립품에 대한 시험방법 — 제5-3부: 재료 및 조립에 대한 일반 시험방법 — 인쇄기판 조립을 위한 솔더 페이스트
电气材料、印制板和其他互连结构和组件的试验方法.第5-3部分:材料和组件的一般试验方法.印制板组件用焊膏
2023-06-30
IEC 61189-5-2-2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
电气材料 印刷电路板和其他互连结构和组件的测试方法第5-2部分:材料和组件的通用测试方法 - 印刷电路板组件的焊剂焊剂
2015-01-08
IEC 61189-5-3-2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
电气材料 印刷电路板和其他互连结构和组件的测试方法 - 第5-3部分:材料和组件的一般测试方法 - 印刷电路板组件的焊膏
2015-01-08
BS EN IEC 61189-2-630-2018
Test methods for electrical materials, printed board and other interconnection structures and assemblies-Test methods for materials for interconnection structures. Moisture absorption after pressure vessel conditioning
电气材料、印制板和其他互连结构和组件的试验方法
2018-10-10
GOST R 52118-2003
Стандартные образцы ядерных материалов для радиационных мониторов. Общие технические требования и методы испытаний
用于辐射监测器的核材料参考资料 一般技术要求和测试方法
GOST R 50629-1993
Радиоактивное вещество особого вида. Общие технические требования и методы испытаний
特殊形式的放射性物质 一般技术要求和试验方法
BS EN IEC 61189-5-601-2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies-General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
电气材料、印制板和其他互连结构和组件的试验方法
2021-03-19