KS K 0003
섬유 용어(직물 부문)
术语词汇在机织物中使用
2017-03-30
KS K 0003
섬유 용어(직물 부문)
纺织工业术语表（机织物）
2022-12-12
ASTM D7507-23
Standard Specification for Woven High Stretch Fabrics Used in Apparel
服装用机织高弹性织物的标准规范
2023-01-01
BS 3396-3-1987
Woven glass fibre fabrics for plastics reinforcement-Specification for finished fabrics for use with polyester resin systems
塑料增强用玻璃纤维机织物
1987-01-30
ASTM D1327/D1327M-04(2020)
Standard Specification for Bitumen-Saturated Woven Burlap Fabrics Used in Roofing and Waterproofing
用于屋顶和防水的沥青饱和编织毛布织物的标准规范
2020-05-01
ASTM D6479-15(2020)
Standard Test Method for Determining the Edgecomb Resistance of Woven Fabrics Used in Inflatable Restraints
用于确定充气式约束中使用的织物的抗皱性的标准测试方法
2020-02-15
GB/T 12630-1990
一般用途的薄覆铜箔环氧玻璃布层压板 （制造多层印制板用）
Thin epoxide woven glass fabric copper-clad laminated sheet， general purpose grade， for use in the fabrication of multilayer printed boards
1990-12-28
ISO 13118-2024
Textile — Biaxial tensile properties of woven fabric — Determination of elasticity properties using a cruciform test piece
纺织品机织物的双轴拉伸性能用十字形试样测定弹性性能
2024-09-06
BS EN 60249-2-17-1993
Specifications-Specification No. 17. Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
规格
2001-06-15
BS EN 60249-2-11-1994
Specifications-Specification for thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards
规格
2001-06-15
JIS C 6493-1999
Base materials for printed circuits -- Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed board
印制电路用基材多层印制板制造用规定可燃性的薄型聚酰亚胺编织玻璃纤维覆铜层压板
1999-01-01
ISO 24281-2021
Textiles — Biaxial tensile properties of woven fabric — Determination of maximum force and elongation at maximum force using the grab method
纺织品.机织物的双向拉伸性能.用抓取法测定最大力和最大力下的伸长率
2021-07-22
BS EN 60249-2-19-1993
Specifications-Specification No. 19. Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
规格 第19号规范 用于制造多层印制板的规定可燃性的双马来酰亚胺/三嗪改性环氧玻璃纤维织物覆铜薄层压板
1992-09-15
JIS C 6494-1999
Base materials for printed circuits -- Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
印制电路用基材多层印制板制造用规定可燃性的双马来酰亚胺/三嗪改性环氧玻璃纤维织物覆铜薄层压板
1999-01-01
KS C IEC 60249-2-11(2017 Confirm)
인쇄 회로 기판 재료－제2부：규격－ 제11장：다층 인쇄 회로 기판 제조용 일반 등급의 박막 에폭시 유리 섬유 직물 동 입힘 적층판
印制电路用基材第2部分:第11号规范:多层印制板制造用通用级薄环氧玻璃纤维布覆铜层压板
2002-08-31
UNE-EN 60249-2-17-1997
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 17: THIN POLYIMIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARD.
印刷电路的基材 第2部分:规范 规范Nº17:多层印制板制造用规定可燃性的薄聚酰亚胺编织玻璃纤维覆铜层压板
1997-08-11
UNE-EN 60249-2-12-1996
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 12: THIN EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY, FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
印刷电路的基材 第2部分:规范 规范12:多层印制板制造用规定可燃性的薄环氧玻璃纤维织物覆铜层压板
1996-07-24
UNE-EN 60249-2-11-1996
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 11: THIN EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE, FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
印刷电路的基材 第2部分:规范 规范11:用于制造多层印制板的通用级薄环氧玻璃纤维织物覆铜层压板
1996-07-24
DIN 19658-3
Polyethylene (PE) coiling pipes and hoses for use in irrigation systems - Hoses of nonrigid material with woven fabric inner layer - Part 3: Dimensions and technical delivery conditions
灌溉系统用聚乙烯（PE）卷绕管和软管.带机织物内层的非刚性材料软管.第3部分:尺寸和交货技术条件
2016-06-01
UNE-EN 60249-2-19/A1-1997
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
印刷电路的基材 第2部分:规范 规范19:多层印制板制造用规定可燃性的双马来酰亚胺/三嗪改性环氧编织玻璃纤维覆铜薄层压板
1997-10-17