BS EN 60749-21-2011
Semiconductor devices. Mechanical and climatic test methods-Solderability
半导体器件 机械和气候试验方法
2011-08-31
KS C IEC 60749-21
반도체 소자 — 기계 및 기후적 시험방법 — 제21부：땜질성
半导体器件 - 机械和气候测试方法 - 第21部分:可焊性
2020-11-20
GB/T 4937.21-2018
半导体器件 机械和气候试验方法 第21部分：可焊性
Semiconductor devices—Mechanical and climatic test methods—Part 21: Solderability
2018-09-17
IEC 60749-21-2011
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
半导体器件 - 机械和气候测试方法 - 第21部分:可焊性
2011-04-07
BS EN IEC 60749-15-2020
Semiconductor devices. Mechanical and climatic test methods-Resistance to soldering temperature for through-hole mounted devices
半导体器件 机械和气候试验方法
2020-10-01
UNE-EN 60749-15-2003
Semiconductor devices - Mechanical and climatic test methods -- Part 15: Resistance to soldering temperature for through-hole mounted devices
半导体器件机械和气候试验方法第15部分:通孔安装器件的耐焊接温度
2003-11-21
GB/T 4937.15-2018
半导体器件 机械和气候试验方法 第15部分：通孔安装器件的耐焊接热
Semiconductor devices—Mechanical and climatic test methods—Part 15: Resistance to soldering temperature for through-hole mounted devices
2018-09-17
IEC 60749-15-2020 RLV
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
半导体器件.机械和气候试验方法.第15部分:通孔安装器件的耐焊接温度
2020-07-14
IEC 60749-15-2020
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
半导体器件 - 机械和气候测试方法 - 第15部分:通孔安装器件的耐焊接温度
2020-07-14
BS IEC 60747-5-4-2022
Semiconductor devices-Optoelectronic devices. Semiconductor lasers
半导体器件.光电器件 半导体雷射
2022-06-20
BS IEC 60747-14-4-2011
Semiconductor devices. Discrete devices-Semiconductor accelerometers
半导体器件 分立器件
2011-02-28
BS 09/30209670 DC
BS EN 60749-21. Semiconductor devices. Mechanical and climatic test methods. Part 21. Solderability
英国标准EN 60749-21 半导体器件 机械和气候试验方法 第21部分 可焊性
2009-09-08
IEC 60747-15-2024 RLV
Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices
半导体器件第15部分:分立器件隔离功率半导体器件
2024-10-22
IEC 60747-15-2024
Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices
半导体器件第15部分:分立器件隔离功率半导体器件
2024-10-22
GB/T 15651.4-2017
半导体器件 分立器件 第5-4部分:光电子器件 半导体激光器
Semiconductor devices—Discrete devices—Part 5-4:Optoelectronic devices—Semiconductor lasers
2017-05-31
BS PD IEC/TR 63133-2017
Semiconductor devices. Scan based ageing level estimation for semiconductor devices
半导体器件 基于扫描的半导体器件老化水平估计
2018-01-29
IEC 60747-5-4-2022+AMD1-2024 CSV
Semiconductor devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
半导体器件第5-4部分:光电子器件半导体激光器
2024-12-13
IEC 60747-5-4-2022
Semiconductor devices - Part 5-4: Optoelectronic devices - Semiconductor lasers
半导体器件第5-4部分:光电子器件半导体激光器
2022-04-27
IEC 60747-14-4-2011
Semiconductor devices - Discrete devices - Part 14-4: Semiconductor accelerometers
半导体器件 - 分立器件 - 第14-4部分:半导体加速度计
2011-01-27
IEC TR 63133-2017
Semiconductor devices - Scan based ageing level estimation for semiconductor devices
半导体器件.半导体器件的基于扫描的老化水平估计
2017-10-11