VDI/VDE 3713 Sheet 7
Technical procurement specification - Solder pastes
技术采购规范-锡膏
1995-11-01
JJF 1965-2022
锡膏厚度测量仪校准规范
Calibration Specification for Solder Paste Inspection Instruments
2022-04-29
DIN 32513-1
Soldering pastes - Part 1: Composition, technical specifications
焊膏.第1部分:成分和技术规范
2005-01-01
BS 5245-1975
Specification for phosphoric acid based flux for soft soldered joints in stainless steel
不锈钢软焊接接头用磷酸基助焊剂规范
1975-09-30
ASTM B813-24
Standard Specification for Water Flushable Liquid and Paste Fluxes for Soldering of Copper and Copper Alloy Tube
铜和铜合金管焊接用水冲洗液体和糊状焊剂的标准规范
2024-07-01
MIL MIL-F-14256F
FLUX, SOLDERING, LIQUID, PASTE FLUX, SOLDER PASTE AND SOLDER-PASTE FLUX, (FOR ELECTRONIC/ELECTRICAL USE), GENERAL SPECIFICATION FOR (S/S BY ANSI/J-STD-004-1995-1995, ANSI/J-STD-005-1995-1995, ANSI/J-STD-006-1995-1995) (SUPERSEDING MIL-F-14256E)
助焊剂 焊接 液体 焊膏助焊剂 焊膏和焊膏助焊剂（电子/电气用） 通用规范（由ANSI/J-STD-004-1995-1995 ANSI/J-STD-005-1995-1995 ANSI/J-STD-006-1995-1995代替MIL-F-14256E）
1993-04-26
QPL QPL-14256-88
FLUX, SOLDERING, LIQUID, PASTE FLUX, SOLDER PASTE AND SOLDER-PASTE FLUX, (FOR ELECTRONIC/ELECTRICAL USE), GENERAL SPECIFICATION FOR (S/S BY ANSI/J-STD-004-1995-1995, ANSI/J-STD-005-1995-1995, ANSI/J-STD-006-1995-1995) (SUPERSEDING QPL-14256-87)
助焊剂 焊接 液体 焊膏助焊剂 焊膏和焊膏助焊剂（电子/电气用） 通用规范（ANSI/J-STD-004-1995-1995 ANSI/J-STD-005-1995-1995 ANSI/J-STD-006-1995-1995 取代QPL-14256-87）
1995-03-31
MIL MIL-F-14256F Amendment 1
FLUX, SOLDERING, LIQUID, PASTE FLUX, SOLDER PASTE AND SOLDER-PASTE FLUX, (FOR ELECTRONIC/ELECTRICAL USE), GENERAL SPECIFICATION FOR (S/S BY ANSI/J-STD-004-1995-1995, ANSI/J-STD-005-1995-1995, ANSI/J-STD-006-1995-1995) (SUPERSEDING MIL-F-14256E)
焊剂 液体 膏状焊剂 焊膏和焊料膏状焊剂（电子/电气用） 通用规范（ANSI/J-STD-004-1995-1995 ANSI/J-STD-005-1995-1995和ANSI/J-STD--006-1995-1995）（代替MIL-F-14256E）
1994-05-18
MIL MIL-F-14256F Notice 1-Cancellation
FLUX, SOLDERING, LIQUID, PASTE FLUX, SOLDER PASTE AND SOLDER-PASTE FLUX, (FOR ELECTRONIC/ELECTRICAL USE), GENERAL SPECIFICATION FOR (S/S BY ANSI/J-STD-004-1995-1995, ANSI/J-STD-005-1995-1995, ANSI/J-STD-006-1995-1995) (SUPERSEDING MIL-F-14256E)
焊剂 液体 膏状焊剂 焊膏和焊料膏状焊剂（电子/电气用） 通用规范（ANSI/J-STD-004-1995-1995 ANSI/J-STD-005-1995-1995和ANSI/J-STD--006-1995-1995）（代替MIL-F-14256E）
1995-06-15
IEC TR 61760-3-1-2022
Surface mounting technology - Part 3-1: Standard method for the specification of components for through hole reflow (THR) soldering – Guidelines for through hole diameter design with solder paste surface printing method
表面安装技术.第3-1部分:通孔回流焊（THR）组件规范的标准方法.使用焊膏表面印刷法的通孔直径设计指南
2022-06-17