BARE DIE AND CHIP SCALE PACKAGES TAPED IN 8 MM AND 12 MM CARRIER TAPE FOR AUTOMATIC HANDLING
裸芯片和芯片级封装 采用8mm和12mm的传送带进行自动处理
2002-06-01
DIN EN 60286-3-1
Packaging of components for automatic handling - Part 3-1: Packaging of surface mount components on continuous tapes - Type V - Pressed carrier tapes (IEC 60286-3-1:2009); German version EN 60286-3-1:2009
自动搬运用部件的包装.第3-1部分:连续胶带上表面安装部件的包装.V型.压载胶带（IEC 60286-3-1-2009）；德文版EN 60286-3-1:2009
2010-02-01
DIN EN 60286-3-2
Packaging of components for automatic handling - Part 3-2: Packaging of surface mount components on continuous tapes - Type VI - Blister carrier tapes of 4 mm width (IEC 60286-3-2:2009); German version EN 60286-3-2:2009
自动搬运用部件的包装.第3-2部分:连续胶带上表面安装部件的包装.第VI类.4mm宽的吸塑带（IEC 60286-3-2-2009）；德文版EN 60286-3-2:2009