高密度互连印制电路用涂树脂铜箔规范
Specification for resin coated copper foil of HDI printed circuit board
2018-01-18
BS 4584-103.2-1990
Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits-Specification for copper foil for use in the manufacture of copper-clad base materials
印制线路板用金属覆层基材 与印刷电路有关的特殊材料 覆铜基材制造用铜箔规范