QJ 3103A-2011
印制电路板设计要求
Design requirement for printed circuit board
2011-07-19
GB 4588.3-1988
印制电路板设计和使用
KS C IEC 61188-1-2(2019 Confirm)
인쇄회로기판 및 인쇄회로기판 조립, 설계 및 사용 제1-2부 : 일반요구사항 - 제어임피던스
印制电路板和印制电路板组件 - 设计和用途 - 1-2部分:一般要求 - 受控阻抗
2003-09-29
KS C IEC 61188-1-1(2019 Confirm)
인쇄회로기판 및 인쇄회로기판 조립, 설계 및 사용 제1-1부: 일반요구사항 - 전자조립을 위한 편평도 고려사항
印制电路板和印制电路板组件 - 设计和用途 - 1-1部分:一般要求 - 为电子组件平整度考虑
2003-09-29
BS EN 61188-5-6-2003
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations-Chip carriers with J-leads on four sides
印制电路板和组件 设计和使用 附件（土地/联合）考虑因素
2003-06-26
BS EN 61188-5-2-2003
Printed boards and assemblies. Design and use. Attachment (land/joint) considerations-Discrete components
印制电路板和组件 设计和使用 附件（土地/联合）考虑因素
2003-10-16
IEC TR 61191-8-2021
Printed board assemblies - Part 8: Voiding in solder joints of printed board assemblies for use in automotive electronic control units - Best practices
印制电路板组件第8部分:汽车电子控制装置用印制电路板组件焊点中的空隙最佳实践
2021-03-19
T/CSTM 00920-2023
印制电路板组件用敷形涂覆材料
2023-02-28
SJ/T 11993-2025
印制电路板组件焊盘坑裂测试方法
2025-05-09
IPC 2252
Design Guide for RF/Microwave Circuit Boards
射频/微波电路板设计指南
2002-06-01
QJ 1890-1990
印制电路板对外连接方式及设计规范
1990-01-20
IEEE 2716-2022
IEEE Guide for the Characterization of the Effectiveness of Printed Circuit Board Level Shielding
IEEE印制电路板级屏蔽效能表征指南草案
2023-05-29
IPC 1131
Information Technology Guide for PWB Manufacturers
印制电路板制造商信息技术指南
2000-04-01
MIL MIL-P-70850
PRINTED WIRING BOARD ASSEMBLY, HELMET (MWLD), SPECIFICATION FOR (NO S/S DOCUMENT)
头盔（MWLD）印制电路板组件规范（无S/S文件）
1992-01-24
MIL MIL-DTL-55302/155B
CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES, HOOD FOR PRINTED WIRING BOARDS (SUPERSEDING MIL-C-55302/155A)
印制电路组件和附件连接器 印制电路板罩（取代MIL-C-55302/155A）
2005-03-09
SJ 20904-2004
软基材微波电路板设计指南
Design guidelines for microwave circuit boards utilizing soft substrates
2004-10-25
T/CESA 1070-2020
绿色设计产品评价技术规范 印制电路板
2020-05-25
BS EN 61188-1-1-1997
Printed boards and assemblies. Design and use. Generic requirements-Flatness considerations for electronic assemblies
印制电路板和组件 设计和使用 一般要求 电子组件的平面度考虑
1997-12-15
BS DD IEC/PAS 62326-7-1-2007
Performance guide for single- and double-sided flexible printed wiring boards
单面和双面柔性印制电路板的性能指南
2007-06-29
MIL MIL-DTL-55302/8F Amendment 1(amendment incorporated)
Connectors, Printed Circuit Subassembly and Accessories: Receptacle, Socket Contacts, Straight-thru, for Multilayered Printed Wiring Boards (.100 Spacing)
印制电路组件和附件的连接器:多层印制电路板（间距为0.100）的直通插座触点
2012-12-05