印制电路用挠性覆铜箔材料试验方法
Test methods for flexible copper-clad material for printde circuits
2017-07-31
SJ 21186-2016
印制电路用挠性覆铜箔层压板规范
GB/T 14708-2017
挠性印制电路用涂胶聚酯薄膜
Adhesive coated polyester film for flexible printed circuits
2017-12-29
GB/T 14709-2017
挠性印制电路用涂胶聚酰亚胺薄膜
Adhesive coated polyimide film for flexible printed circuits
2017-12-29
SJ/T 11741-2019
挠性印制电路材料的耐挠曲性测试方法
Test methods of the f1exural endurance for materials offlexible printed circuits
2019-11-11
SJ 21185-2016
印制电路用挠性基材环境试验方法
GB/T 13556-2017
挠性印制电路用聚酯薄膜覆铜板
Copper-clad polyester film laminates for flexible printed circuits
2017-12-29
GB/T 13555-2017
挠性印制电路用聚酰亚胺薄膜覆铜板
Copper-clad polyimide film laminates for flexible printed circuits
2017-12-29
SJ 21182-2016
印制电路用挠性基材化学性能测试方法
SJ 21183-2016
印制电路用挠性基材电气性能测试方法
SJ 21184-2016
印制电路用挠性基材机械性能测试方法
SJ 21180-2016
印制电路用挠性基材外观和尺寸检验方法
SJ 21181-2016
印制电路用挠性基材物理性能测试方法
MIL MIL-P-50884D Notice 2-Amendment 2
PRINTED WIRING BOARD, FLEXIBLE OR RIGID-FLEX GENERAL SPECIFICATION FOR (SUPERSEDING MIL-P-50884C)
挠性或硬挠性印制电路板通用规范（代替MIL-P-50884C）
2006-05-29
BS 4584-103.3-1992
Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits-Specification for permanent polymer coating materials (solder resist) for use in the fabrication of printed boards
印制线路板用金属覆层基材 与印刷电路有关的特殊材料 印制板制造用永久性聚合物涂层材料（阻焊剂）规范
1992-03-31
KS C IEC 60249-2-7(2017 Confirm)
인쇄 회로 기판 재료－ 제2부：규격－제7장：가연성 페놀셀룰로오스 종이 동입힘 적층판 (수직 연소 시험)
印制电路用基材第2部分:规范第7号规范:规定可燃性的酚醛纤维素纸覆铜层压板（垂直燃烧试验）
2002-05-30
DIN IEC 60249-3-3
Base materials for printed circuits; part 3: special materials; specification No. 3: permanent polymer coating materials (solder-resist) for use in the fabrication of printed boards; identical with IEC 60249-3-3:1991
印刷电路用基材；第三部分:特殊材料；规范3:印制板制造用永久性聚合物涂层材料（阻焊剂）；与IEC 60249-3-3:1991相同