印制板清洁度测试方法及要求
Test methods and requirements of cleanliness for printed circuit boards
2016-01-19
SJ 21098-2016
印制板显微剖切方法及要求
Test methods and requirements of microsection for printed circuit boards
2016-01-19
DB44/T 1555-2015
高密度印制电路板的互连应力测试方法
2015-03-26
SC 108-1982
渔船电子设备印制板焊接技术要求及检验方法
1982-12-01
GB/T 19247.6-2024
印制板组装 第6部分:球栅阵列（BGA）和盘栅阵列（LGA）焊点空洞的评估要求及测试方法
Printed board assemblies—Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
2024-03-15
IEC TR 61189-5-506-2019
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-506: General test methods for materials and assemblies - An intercomparison evaluation to implement the use of fine-pitch test structures for surface insulation resistance (SIR) testing of solder fluxes in accordance with IEC 61189-5-501
电气材料的试验方法 印制板和其他互连结构及组件.第5-506部分:材料和组件的一般试验方法.根据IEC 61189-5-501 使用细间距试验结构进行焊剂表面绝缘电阻（SIR）试验的相互比较评估