现行 SJ/T 11104-2016
金电镀层规范 金电镀层规范 Specification for electrodeposited gold coatings
发布日期:2016-01-15
实施日期:2016-06-01
分类信息
研制信息

归口单位: 工业和信息化部电子工业标准化研究院

起草单位: 中国电子科技集团公司第十四研究所

起草人: 吴礼群、 孙兆军、 王伟

标准简介

本标准规定了金电镀层的性能指标要求和质量保证规定等内容。金镀层要求主要包括:材料、工艺和设备,基体材料,预处理,底镀层,后处理,及金镀层性能指标体系。金镀层性能指标主要包括:外观质量、厚度、结合力、硬度、耐热性、可焊性、残留盐、表面粗糙度、耐磨性、孔隙率、耐蚀性、电气性能、镀层成分等内容

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电镀

最后更新时间 2025-09-02