QB/T 1546-2016
陶瓷釉料熔融温度范围测定方法
Test method for melting temperature range of ceramic glaze
2016-01-15
GB/T 44549-2024
高温条件下陶瓷材料界面黏结强度试验方法
Test method for interfacial bond strength of ceramic materials at elevated temperatures
2024-09-29
BS ISO 17095-2013
Fine ceramics (advanced ceramics, advanced technical ceramics). Test method for interfacial bond strength of ceramic materials at elevated temperatures
精细陶瓷（高级陶瓷、高级工业陶瓷） 高温下陶瓷材料界面粘结强度的试验方法
2013-08-31
ISO 17095-2013
Fine ceramics (advanced ceramics, advanced technical ceramics) — Test method for interfacial bond strength of ceramic materials at elevated temperatures
精细陶瓷（高级陶瓷、高级工业陶瓷）——高温下陶瓷材料界面粘结强度的试验方法
2013-07-31
BS ISO 14627-2012
Fine ceramics (advanced ceramics, advanced technical ceramics). Test method for fracture resistance of silicon nitride materials for rolling bearing balls at room temperature by indentation fracture (IF) method
精细陶瓷（高级陶瓷、高级工业陶瓷） 用压痕断裂（IF）法测定室温下滚动轴承球用氮化硅材料抗断裂性的试验方法
2012-07-31
ISO 14627-2012
Fine ceramics (advanced ceramics, advanced technical ceramics) — Test method for fracture resistance of silicon nitride materials for rolling bearing balls at room temperature by indentation fracture (IF) method
精细陶瓷（高级陶瓷、高级工业陶瓷）——用压痕断裂（IF）法测定室温下滚动轴承球用氮化硅材料抗断裂性的试验方法
2012-07-06
BS EN 61189-11-2013
Test methods for electrical materials, printed boards and other interconnection structures and assemblies-Measurement of melting temperature or melting temperature ranges of solder alloys
电气材料、印制板和其他互连结构和组件的试验方法
2013-07-31
KS C IEC 61189-11
전기재료, 인쇄회로기판, 기타 상호접속 구조 및 조립품에 대한 시험방법 — 제11부: 솔더 합금의 융점 또는 융점의 범위 측정
电气材料 印刷电路板和其他互连结构和组件的测试方法 - 第11部分:焊接温度或熔融温度范围的测量
2025-02-17
IEC 61189-11-2013
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
电气材料 印刷电路板和其他互连结构和组件的测试方法 - 第11部分:焊接温度或熔融温度范围的测量
2013-05-07
BS 09/30208696 DC
BS EN 61189-11. Test methods for electrical materials, interconnection structures and assemblies. Part 11. Measurement of melting temperature and melting temperature ranges of solder alloys
BS EN 61189-11 电气材料、互连结构和组件的试验方法 第11部分 钎料合金熔化温度和熔化温度范围的测量
2009-08-19
DIN IEC 61189-11-DRAFT
Draft Document - Test methods for electrical materials, interconnection structures and assemblies - Part 11: Measurement of melting temperature and melting temperature ranges of solder alloys (IEC 91/879/CD:2009)
文件草稿.电气材料 互连结构和组件的试验方法.第11部分:焊接合金熔化温度和熔化温度范围的测量（IEC 91/879/CD:2009）
2009-11-01
DIN EN 61189-11
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys (IEC 61189-11:2013); German version EN 61189-11:2013
电气材料、印制板和其他互连结构和组件的试验方法.第11部分:焊接合金熔化温度或熔化温度范围的测量（IEC 61189-11-2013）；德文版EN 61189-11:2013
2014-02-01