Use of Pb-Free Ball Grid Array Component Soldered Using SnPb Solder
SnPb焊料无铅球栅阵列元件的应用
2019-07-23
GB/T 26147-2010
球阀球体 技术条件
Specification for ball of ball valve
2011-01-14
ECA/EIA CB 3
SPECIFICATIONS AND STANDARDS ASSOCIATED WITH SOLDERS AND SOLDERING
与焊料和焊接相关的规范和标准
1966-05-01
GOST 7524-2015
Шары мелющие стальные для шаровых мельниц. Технические условия
磨球用球磨机 规格
2015-08-27
SJ/T 10146-1991
焊槽法可焊性测试仪技术条件
Specification for solderability test instrument by solder bath method
1991-04-02
BS PD IEC/TS 62647-4-2018
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder-Ball grid array (BGA) re-balling
航空电子设备的过程管理 含无铅焊料的航空航天和国防电子系统
2018-04-25
AWS C3.11M/C3.11-2011
Specification for Torch Soldering
焊炬焊接规范
2011-07-14
AWS C3.12M/C3.12-2017
Specification for Furnace Soldering
熔炉焊接规范
2017-05-23
SJ 3190-1989
球阀技术条件
Specification for ball valve
1989-02-10
BS 5993-1994
Specification for cricket balls
板球规范
1995-01-15
GOST R 59379-2021
Мячи набивные. Технические условия
填充球 规格
BS 6101-6-1990
Machine tool ball screws-Specification for ball nuts and principal dimensions of ball screws
机床滚珠丝杠
1990-11-30
GB/Z 41275.4-2023
航空电子过程管理 含无铅焊料航空航天及国防电子系统 第4部分：球栅阵列植球
Process management for avionics—Aerospace and defence electronic systems containing lead-free solder—Part 4:Ball grid array（BGA）re-balling
2023-12-28
IEC TS 62647-4-2018
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 4: Ball grid array (BGA) re-balling
航空电子设备的过程管理.含无铅焊料的航空航天和国防电子系统.第4部分:球栅阵列（BGA）再成球