QJ 831B-2011
航天用多层印制电路板通用规范
General specification for multilayer printed board for aerospace
2011-07-19
QJ 832B-2011
航天用多层印制电路板试验方法
Test method of multilayer printed board for aerospace
2011-07-19
T/ZZB 2922-2022
汽车电子安全件用多层印制电路板
2022-12-08
QJ 2152-1991
挠性印制电路板技术条件
1991-02-05
QJ 201B-2012
航天用刚性单双面印制电路板规范
Specification for rigid single-sided and double-sided printed circuit board of aerospace
2013-01-04
QJ 3113-1999
多层印制电路板用粘结片复验规则和方法
1999-04-02
QJ 1719-1989
印制电路板阻焊膜及字符标志技术条件
1989-02-22
QJ 2940A-2001
航天用印制电路板组装件修复和改装技术要求
The repair and modification of printed circuit board assemblies for space use
2001-11-15
QJ 1887-1990
印制电路板生产用照相底版的技术条件及制作方法
1990-01-20
MIL MIL-DTL-55302/111B
CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: RECEPTACLE SOCKET CONTACTS, STRAIGHT-THRU, FOR MULTILAYERED PRINTED WIRING BOARDS (.100 SPACING)(SUPERSEDING MIL-C-55302/111A)
印制电路组件和附件连接器:多层印制电路板用直通插座触点（.100间距）（取代MIL-C-55302/111A）
2006-05-22
MIL MIL-C-55302/112 Notice 1-Cancellation
CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: PINS, RIGHT-ANGLE, FOR MULTILAYERED PRINTED WIRING BOARDS (.100 INCH CONTACT SPACING) (112 CONTACTS, SPECIAL) (NO S/S DOCUMENT)
印制电路组件和附件连接器:多层印制电路板用直角插脚（.100英寸触点间距）（112个触点 特殊）（无S/S文件）
1979-09-07
MIL MIL-C-55302/48 Notice 1-Cancellation
CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: SOCKET, STRAIGHT-THRU, FOR MULTILAYERED PRINTED WIRING BOARDS (.100 INCH CONTACT SPACING) (56 AND 112 CONTACTS) (NO S/S DOCUMENT)
印制电路组件和附件连接器:多层印制电路板用直通插座（.100英寸触点间距）（56和112触点）（无S/S文件）
1979-09-07
MIL MIL-DTL-55302/22F
CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: RECEPTACLE, SOCKET CONTACTS, STRAIGHT-THRU, FOR MULTILAYERED PRINTED WIRING BOARDS (.100 SPACING) (SUPERSEDING MIL-C-55302/22E)
印制电路组件和附件连接器:多层印制电路板用直通插座、插座触点（.100间距）（取代MIL-C-55302/22E）
2004-03-24
QJ 2707-1995
印制电路板计算机辅助设计光绘照相原版技术条件
1995-04-26
MIL MIL-DTL-55302/76D
CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES, SOCKET STRAIGHT-THRU, POLARIZED FOR MULTILAYERED PRINTED WIRING BOARDS (.100 SPACING) (SEE BASE FOR INACTIVATION NOTICE) (SUPERSEDING MIL-C-55302/76C)
多层印制电路板用极化直通插座（间距为（.100）印制电路组件和附件连接器（参见基底灭活通知）（取代MIL-C-55302/76C）
2004-11-12
QJ 2466-1993
印制电路板涂覆锡铅合金热风整平技术条件及操作规程
1993-03-30
MIL MIL-DTL-55302/77D
CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES, PIN, RIGHT ANGLE, FOR MULTILAYERED PRINTED WIRING BOARDS (.100 SPACING) (SEE BASE FOR INACTIVATION NOTICE) (SUPERSEDING MIL-C-55302/77C)
多层印制电路板用直角插针式印制电路组件和附件连接器（.100间距）（参见基底灭活通知）（取代MIL-C-55302/77C）
2004-11-12
NASA RP 1161
EVALUATION OF MULTILAYER PRINTED WIRING BOARDS BY METALLOGRAPHIC TECHNIQUES - AN ILLUSTRATED GUIDE TO THE PREPARATION & INSPECTION OF PLATED-THROUGH HOLE TEST COUPONS BASED ON THE REQUIREMENTS OF MIL-P-55110D
用金相技术评估多层印制电路板——根据MIL-P-55110D要求制备和检查电镀通孔试样的图解指南
1986-05-01
MIL MIL-C-55302/22E
CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: RECEPTACLE, SOCKET CONTACTS, STRAIGHT-THRU, FOR MULTILAYERED PRINTED WIRING-BOARDS (.100 SPACING) (SUPERSEDING MIL-C-55302/22D) (S/S BY MIL-DTL-55302/22F)
印制电路组件和附件连接器:多层印制电路板用直通插座、插座触点（.100间距）（取代MIL-C-55302/22D）（S/S由MIL-DTL-55302/22F提供）
1979-12-12
MIL MIL-C-55302/5D
CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: PLUG, PIN CONTACTS, STRAIGHT-THRU, FOR MULTILAYERED PRINTED WIRING BOARDS (.100 SPACING) (SUPERSEDING MIL-C-55302/5C) (S/S BY MIL-DTL-55302/5E)
印制电路组件和附件连接器:多层印制电路板用直通插头、插针触点（.100间距）（取代MIL-C-55302/5C）（S/S由MIL-DTL-55302/5E提供）
1979-12-12