SJ 21401-2018
微电子封装陶瓷外壳 磨边及裂片工艺技术要求
Ceramic packages for microelectronics packaging-Technical requirements for edge-grinding and splitting process
2018-01-18
SJ 21402-2018
微电子封装陶瓷及金属外壳 钎焊后处理工艺技术要求
Ceramic and metal packages for microelectronics packaging-Technical requirements for processing after brazing
2018-01-18
SJ 21407-2018
微电子封装陶瓷及金属外壳 零件清洗工艺技术要求
Ceramic and metal packages for microelectronic packaging-Technical requirements for parts cleaning process
2018-01-18
SJ 21406-2018
微电子封装陶瓷外壳 镀镍瓷件检验要求
Ceramic packages for microelectronic packaging-Inspection requirements for nickel plated ceramic parts
2018-01-18
SJ 21399-2018
微电子封装陶瓷及金属外壳 组装件检验要求
Ceramic and metal packages for microelectronic packaging-Inspection requirements for assembly parts
2018-01-18
SJ 21400-2018
微电子封装陶瓷及金属外壳 金属零件检验要求
Ceramic and metal packages for microelectronic packaging-Inspection requirements for metal parts
2018-01-18
SJ 21405-2018
微电子封装金属外壳 铝硅外壳镀覆工艺技术要求
Metal packages for microelectronic packaging-Technical requirements for the plating process of aluminium-silicon alloy packages
2018-01-18
SJ 21403-2018
微电子封装金属外壳 玻璃绝缘子工艺技术要求
Metal packages for microelectronic packaging-Technical requirements for the manufacturing process of glass insulator
2018-01-18
SJ 21404-2018
微电子封装金属外壳 可伐零件预氧化工艺技术要求
Metal packages for microelectronic packaging-Technical requirements for the pre-oxidation process of Kovar piece-parts
2018-01-18
SJ 21333-2018
陶瓷外壳及金属外壳钎焊工艺技术要求
Ceramic package and metal package Technical requirements for braze process
2018-01-18
SJ 21334-2018
陶瓷外壳及金属外壳电镀镍工艺技术要求
Ceramic packages and metal packages Technical requirements for nickel electroplating process
2018-01-18
SJ 21332-2018
陶瓷外壳及金属外壳 化学镀镍工艺技术要求
Ceramic packages and metal packages Technical requirements for electroless nickel plating process
2018-01-18
SJ 21550-2020
微电子封装陶瓷外壳高速信号传输性能测试方法
Test method for high speed signal transfer charactrics of microelectronics ceramic packages
2020-06-03
SJ 21331-2018
陶瓷外壳及金属外壳金属零件热处理工艺技术要求
Ceramic packages and metal packages Technical requirements for the heat treatment of the metal parts process
2018-01-18
SJ 21326-2018
陶瓷外壳 插装类装架工艺技术要求
Ceramic packages Technical requirements for assembling process of through-hole type
2018-01-18
SJ 21327-2018
陶瓷外壳 贴装类装架工艺技术要求
Ceramic packages Technical requirements for assembling process of surface-mounted type
2018-01-18
SJ 21450-2018
集成电路陶瓷封装 原片减薄工艺技术要求
Integrated circuit ceramic package-Technical requirement for wafer-thinning process
2018-01-18
SJ 21451-2018
集成电路陶瓷封装 圆片划片工艺技术要求
Integrated circuit ceramic package-Technical requirement for wafer-sawing process
2018-01-18
SJ 21452-2018
集成电路陶瓷封装 芯片胶粘接装骗工艺技术要求
Interated circuit ceramic package-Technical requirements for die-attachment process by adhesives
2018-01-18
SJ 21453-2018
集成电路陶瓷封装 金丝键合工艺技术要求
Integrated circuit ceramic package-Technical requirements for gold wire bonding process
2018-01-18