微波组件印制板焊膏印刷工艺技术要求
Technical requirements for pasting solder on PCB of microwave assembly
2018-01-18
SJ 21521-2018
电子装备印制板组件数字化工艺设计要求
BS 95/208507 DC
IEC 1188-5-3. Design and use of printed boards and printed board assemblies. Part 5. Sectional design and use requirements. Attachment (land/joint) considerations. Section 3. Components with gull-wing leads on two sides 52/574/CD. Components with Gull-wing leads on two sides
IEC 1188-5-3 印制板和印制板组件的设计和使用 第五部分 分段设计和使用要求 附件（土地/联合）注意事项 第三节 两侧带有鸥翼引线的部件52/574/CD 两侧带有鸥翼引线的部件