JB/T 4127.2-2013
机械密封 第2部分：分类方法
Mechanical seal-Part 2:Classification method
2013-04-25
KS C IEC 60749-8(2016 Confirm)
반도체 소자－기계 및 기후적 환경 시험 방법－제8부：봉합
半导体器件机械和气候试验方法第8部分:密封
2006-11-30
UNE-EN 60749-8-2004
Semiconductor devices - Mechanical and climatic test methods -- Part 8: Sealing
半导体器件机械和气候试验方法第8部分:密封
2004-05-28
KS C IEC 60749-8(2021 Confirm)
반도체 소자－기계 및 기후적 환경 시험 방법－제8부：봉합
半导体器件机械和气候试验方法第8部分:密封
2006-11-30
IEC 60749-8-2002
Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
半导体器件 - 机械和气候测试方法 - 第8部分:密封
2002-08-30
KS C IEC 62341-5-2
유기발광다이오드(OLED) 디스플레이 — 제5-2부: 기계적 내구성 시험방법
有机发光二极管（OLED）显示器.第5-2部分:机械耐久性试验方法
2023-06-30
IEC 62341-5-2-2019 RLV
Organic light emitting diode (OLED) displays - Part 5-2: Mechanical endurance test methods
有机发光二极管（OLED）显示器.第5-2部分:机械耐久性试验方法
2019-03-18
IEC 62341-5-2-2019
Organic light emitting diode (OLED) displays - Part 5-2: Mechanical endurance test methods
有机发光二极管（Oled）显示器 - 第5-2部分:机械耐久性测试方法
2019-03-18
GB/T 2423.23-2013
环境试验 第2部分：试验方法 试验Q：密封
Environmental testing - Part 2：Test methods - Test Q: Sealing
2013-11-12
TY/T 1002.2-2009
体育照明使用要求及检验方法 第2部分：综合体育馆
Technical requirements and test methods for venues lighting Part 2:Lighting for multipurpose stadiums
2009-02-16
BS 10/30213320 DC
BS EN 62341-5-2. Organic light emitting diode (OLED) displays. Part 5-2. Mechanical endurance test methods
英国标准EN 62341-5-2 有机发光二极管（OLED）显示器 第5-2部分 机械耐久性试验方法
2010-04-22
UNE-IEC 60512-7-2005
Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 7: Mechanical operating tests and sealing tests
电子设备用机电元件；基本试验程序和测量方法第7部分:机械操作试验和密封试验
2005-05-18
KS C IEC 60512-7(2019 Confirm)
전자기기용 전기기계 부품 — 기본시험 절차 및 측정방법 — 제7부: 기계적 동작시험 및 봉합시험
电子设备机电组件 - 基本测试程序和测量方法 - 第7部分:机械操作测试和密封测试
2014-12-09
KS C IEC 60512-7(2024 Confirm)
전자기기용 전기기계 부품 — 기본시험 절차 및 측정방법 — 제7부: 기계적 동작시험 및 봉합시험
电子设备用机电元件基本试验程序和测量方法第7部分:机械操作试验和密封试验
2014-12-09
GB/T 5095.7-1997
电子设备用机电元件 基本试验规程及测量方法 第7部分:机械操作试验和密封性试验
Electromechanical components for electronic equipment--Basic testing procedures and measuring methods--Part 7:Mechanical operating tests and sealing tests
1997-12-26
MIL MIL-STD-750-2A Change 1
Mechanical Test Methods for Semiconductor Devices Part 2: Test Methods 2001 Through 2999
半导体器件的机械测试方法第2部分:测试方法2001至2999
2015-12-24
MIL MIL-STD-750-2 Change 3(all previous changes incorporated)
Mechanical Test Methods for Semiconductor Devices Part 2: Test Methods 2001 Through 2999
半导体器件的机械测试方法第2部分:测试方法2001至2999
2013-04-29
MIL MIL-STD-750-2A Change 4
Mechanical Test Methods for Semiconductor Devices Part 2: Test Methods 2001 Through 2999
半导体器件的机械试验方法第2部分:试验方法2001～2999
2020-02-29
MIL MIL-STD-750-2 Change 4(all previous changes incorporated)
Mechanical Test Methods for Semiconductor Devices Part 2: Test Methods 2001 Through 2999
半导体器件的机械试验方法第2部分:试验方法2001～2999
2013-09-01
MIL MIL-STD-750-2 Change 5(all previous changes incorporated)
Mechanical Test Methods for Semiconductor Devices Part 2: Test Methods 2001 Through 2999
半导体器件的机械试验方法第2部分:试验方法2001～2999
2014-05-02