现行 SJ/T 11725-2018
印制电路用导热型覆铜箔环氧复合基层压板 印制电路用导热型覆铜箔环氧复合基层压板 Thermal conduction epoxy composites material copper-clad laminated sheets for printed circuits board
发布日期:2018-04-30
实施日期:2018-07-01
分类信息
研制信息

归口单位: 全国印制电路标准化技术委员会

起草单位: 浙江华正新材料股份有限公司、 咸阳瑞德科技有限公司、 陕西生益科技有限公司

起草人: 沈宗华、 高艳茹、 蒋伟

标准简介

本标准规定了印制电路用导热型覆铜箔环氧复合基层压板(以下简称导热复合基覆铜板)的分类、技术要求、试验方法、检验规则、标志、包装、储存及运输等。本标准适用于厚度0.6 mm~2.0mm 的导热复合基覆铜板

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Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1.5 W/(m·K) and defined flammability (vertical burning test), copper-clad for
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DIN EN IEC 61249-2-45
Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1.0 W/(m·K) and defined flammability (vertical burning test), copper-clad for
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DIN EN IEC 61249-2-47
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最后更新时间 2025-09-02