2893(RP-295)
Finned Tube Contact Conductance: Empirical Correlation of Thermal Conductance
翅片管接触电导:热导率的经验关联
3103(RP-446)
Thermal Contact Conductance of Finned Tubes: A Generalized Correlation
翅片管的接触热导率:广义关联式
ASM Cu-341
CHASE 14310 - Thermal Softening Resistant, High Conductivity Copper
CHASE 14310-耐热软化、高导电性铜
1977-10-01
3104(RP-446)
Thermal Contact Conductance of Finned Tubes: The Effect of Various Parameters
翅片管的接触热导率:各种参数的影响
UNE-EN 13604-2003
Cooper and copper alloys - Products of high conductivity copper for electronic tubes, semicondcutor devices and vacuum applications.
铜和铜合金.电子管 半导体汽车设备和真空应用用高导电性铜产品
2003-05-09
SJ/T 11725-2018
印制电路用导热型覆铜箔环氧复合基层压板
Thermal conduction epoxy composites material copper-clad laminated sheets for printed circuits board
2018-04-30
DIN EN IEC 61249-2-46
Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1.5 W/(m·K) and defined flammability (vertical burning test), copper-clad for
印制板和其他互连结构用材料第2-46部分:包覆和非包覆增强基材导热系数为1.5W/（m·K）和规定可燃性（垂直燃烧试验）的包铜非卤化环氧无纺/编织E玻璃增强层压板
2018-10-01
DIN EN IEC 61249-2-45
Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1.0 W/(m·K) and defined flammability (vertical burning test), copper-clad for
印制板和其他互连结构用材料第2-45部分:包覆和非包覆增强基材导热系数为1.0W/（m·K）和规定可燃性（垂直燃烧试验）的覆铜非卤化环氧无纺/编织E玻璃增强层压板
2018-10-01
DIN EN IEC 61249-2-47
Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2.0 W/(m·K) and defined flammability (vertical burning test), copper-clad for
印制板和其他互连结构用材料第2-47部分:包覆和非包覆增强基材导热系数为2.0W/（m·K）和规定可燃性（垂直燃烧试验）的覆铜非卤化环氧无纺/编织E玻璃增强层压板
2018-10-01
BS EN IEC 61249-2-46-2018
Materials for printed boards and other interconnecting structures-Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.5W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
印制板和其他互连结构用材料
2018-04-16
BS EN IEC 61249-2-45-2018
Materials for printed boards and other interconnecting structures-Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.0W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
印制板和其他互连结构用材料
2018-04-13
KS C IEC 61249-2-45
인쇄회로기판 및 기타 상호접속 구조용 재료 — 제2-45부: 클래드/언클래드 강화 기본 재료 — 열전도율 1.0 W/(m･K) 및 지정 난연성(수직연소 시험)을 가진 비할로겐 에폭시 부직/직조 E-유리강화 적층 시트, 무연 조립용 동박
印制板和其它互连结构用材料 第2-45部分:增强基材包覆和未包覆 导热系数为1.0 W/(m•K)和规定可燃性（垂直燃烧试验）的非卤化环氧化物无纺/编织E-玻璃增强层压板 用于无铅装配
2025-02-17
KS C IEC 61249-2-46
인쇄회로기판 및 기타 상호접속 구조용 재료 — 제2-46부: 클래드/언클래드 강화 기본 재료 — 열전도율 1.5 W/(m･K) 및 지정 난연성(수직연소 시험)을 가진 비할로겐 에폭시 부직/직조 E-유리강화 적층 시트, 무연 조립용 동박
印制板和其它互连结构用材料 第2-46部分:增强基材包覆和未包覆 导热系数为1.5 W/(m•K)和规定的可燃性（垂直燃烧试验）的无铅装配用铜包覆的非卤化环氧化物无纺/编织E-玻璃增强层压板
2025-02-17
KS C IEC 61249-2-47
인쇄회로기판 및 기타 상호접속 구조용 재료 — 제2-47부: 클래드/언클래드 강화 기본 재료 — 열전도율 2.0 W/(m･K) 및 지정 난연성(수직연소 시험)을 가진 비할로겐 에폭시 부직/직조 E-유리강화 적층 시트, 무연 조립용 동박
印制板和其它互连结构用材料 第2-47部分:增强基材包覆和未包覆 导热系数为2.0 W/(m•K)和规定可燃性（垂直燃烧试验）的无铅装配用铜包覆的非卤化环氧化物无纺/编织E-玻璃增强层压板
2025-02-17
IEC 61249-2-47-2018
Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m？K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
印制板和其他互连结构用材料.第2-47部分:包层和非包层增强基材.无铅组装用包铜、导热系数为2.0W/（m？K）和规定可燃性（垂直燃烧试验）的非卤化环氧无纺/编织E玻璃增强层压板
2018-01-10
IEC 61249-2-45-2018
Materials for printed boards and other interconnecting structures - Part 2-45: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,0 W/(m？K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
印制板和其他互连结构用材料.第2-45部分:包层和非包层增强基材.无铅组装用包铜导热系数为1.0W/（m？K）和规定可燃性（垂直燃烧试验）的非卤化环氧无纺/编织E玻璃增强层压板
2018-01-10
IEC 61249-2-46-2018
Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 1,5 W/(m？K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
印制板和其他互连结构材料.第2-46部分:包覆和非包覆增强基材.无铅组件用导热系数为1.5W/（m？K）和规定可燃性（垂直燃烧试验）的非卤化环氧化物无纺/编织E玻璃增强层压板
2018-01-10