Semiconductor devices - Mechanical and climatic test methods -- Part 15: Resistance to soldering temperature for through-hole mounted devices
半导体器件机械和气候试验方法第15部分:通孔安装器件的耐焊接温度
2003-11-21
GB/T 4937.15-2018
半导体器件 机械和气候试验方法 第15部分：通孔安装器件的耐焊接热
Semiconductor devices—Mechanical and climatic test methods—Part 15: Resistance to soldering temperature for through-hole mounted devices
2018-09-17
IEC 60749-15-2020 RLV
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
半导体器件.机械和气候试验方法.第15部分:通孔安装器件的耐焊接温度
2020-07-14
GB/T 4937.20-2018
半导体器件 机械和气候试验方法 第20部分：塑封表面安装器件耐潮湿和焊接热综合影响
Semiconductor devices—Mechanical and climatic test methods—Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
2018-09-17
DIN EN IEC 60749-15
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2020); German version EN IEC 60749-15:2020
半导体器件.机械和气候试验方法.第15部分:通孔安装器件的耐焊接温度（IEC 60749-15-2020）；德国版本EN IEC 60749-15:2020