SJ/Z 9021.4-1987 半导体器件的机械标准化 第4部分:半导体器件封装外形图类型的划分以及编号体系

Mechanical standardization of semiconductor devices -- Part 4: Coding system and classification into forms of package outlines for semiconductor device packages.
半导体器件机械标准化第4部分:半导体器件封装外形的编码系统和分类

2001-01-23

半导体器件的机械标准化 第4部分：半导体器件封装外形的分类和编码体系
Mechanical standardization of semiconductor devices—Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

2019-08-30

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
半导体器件的机械标准化第4部分:半导体器件封装外形的编码系统和分类

2018-03-27

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
半导体器件的机械标准化 - 第4部分:编码系统和分类为半导体器件封装的封装轮廓形式

2013-10-10

Amendment 1 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
修改件1.半导体器件的机械标准化.第4部分:半导体器件封装外形的编码系统和分类

2018-03-27

Amendment 4 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件4.半导体器件的机械标准化.第2部分:尺寸

2001-11-27

Draft Document - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 47D/769/CD:2010)
文件草稿.半导体器件的机械标准化.第4部分:半导体器件封装外形的编码系统和分类形式（IEC 47D/769/CD:2010）

2010-07-01

半导体器件的机械标准化 第6-4部分：表面安装半导体器件封装外形图绘制的一般规则 焊球阵列（BGA）封装的尺寸测量方法
Mechanical standardization of semiconductor devices—Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of ball grid array (BGA)

2023-05-23

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
半导体器件的机械标准化.第6-4部分:表面安装半导体器件封装外形图绘制的一般规则.球栅阵列（BGA）封装尺寸的测量方法

2003-06-11

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (IEC 60191-6-4:2003); German version EN 60191-6-4:2003
半导体器件的机械标准化.第6-4部分:表面安装半导体器件封装外形图绘制的一般规则.球栅阵列（BGA）封装尺寸的测量方法（IEC 60191-6-4-2003）；德文版EN 60191-6-4:2003

2004-01-01