IEC 60191-2-1966/AMD1-2001
Amendment 1 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件1.半导体器件的机械标准化.第2部分:尺寸
2001-03-15
IEC 60191-2X-1999
Mechanical standardization of semiconductor devices - Part 2: Dimensions
半导体器件的机械标准化.第2部分:尺寸
1999-09-30
IEC 60191-2-1966
Mechanical standardization of semiconductor devices. Part 2: Dimensions
半导体器件的机械标准化 第2部分:尺寸
1966-01-01
IEC 60191-1-2018
Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
半导体器件的机械标准化 - 第1部分:分立器件外形图准备的一般规则
2018-01-23
IEC 60191-4-2013/AMD1-2018
Amendment 1 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
修改件1.半导体器件的机械标准化.第4部分:半导体器件封装外形的编码系统和分类
2018-03-27
UNE-EN 60749-1-2004
Semiconductor devices - Mechanical and climatic test methods -- Part 1: General
半导体器件机械和气候试验方法第1部分:总则
2004-05-28
KS C IEC 60749-1(2016 Confirm)
반도체 소자－기계 및 기후적 환경 시험 방법－제1부：일반 사항
半导体器件机械和气候试验方法第1部分:总则
2006-11-30
KS C IEC 60749-1(2021 Confirm)
반도체 소자－기계 및 기후적 환경 시험 방법－제1부：일반 사항
半导体器件机械和气候试验方法第1部分:总则
2006-11-30
GB/T 4937.1-2006
半导体器件 机械和气候试验方法 第1部分: 总则
Semiconductor devices―Mechanical and climatic test methods―Part 1: General
2006-08-23
IEC 60749-1-2002
Semiconductor devices - Mechanical and climatic test methods - Part 1: General
半导体器件 - 机械和气候测试方法 - 第1部分:总则
2002-08-30
IEC 60191-2-1966/AMD9-2003
Amendment 9 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件9.半导体器件的机械标准化.第2部分:尺寸
2003-11-19
IEC 60191-2-1966/AMD7-2002
Amendment 7 - Mechanical standardization of semiconductor devices. Part 2: Dimensions
修改件7——半导体器件的机械标准化 第2部分:尺寸
2002-05-10
IEC 60191-2-1966/AMD21-2020
Amendment 21 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件21.半导体器件的机械标准化.第2部分:尺寸
2020-02-13
IEC 60191-2-1966/AMD4-2001
Amendment 4 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件4.半导体器件的机械标准化.第2部分:尺寸
2001-11-27
IEC 60191-2-1966/AMD3-2001
Amendment 3 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件3.半导体器件的机械标准化.第2部分:尺寸
2001-08-28
IEC 60191-2-1966/AMD2-2001
Amendment 2 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件2.半导体器件的机械标准化.第2部分:尺寸
2001-06-20
IEC 60191-2-1966/AMD16-2007
Amendment 16 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件16.半导体器件的机械标准化.第2部分:尺寸
2007-07-25
IEC 60191-2-1966/AMD11-2004
Amendment 11 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件11.半导体器件的机械标准化.第2部分:尺寸
2004-11-23
IEC 60191-2-1966/AMD14-2006
Amendment 14 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件14.半导体器件的机械标准化.第2部分:尺寸
2006-07-17
IEC 60191-2-1966/AMD20-2018
Amendment 20 - Mechanical standardization of semiconductor devices - Part 2: Dimensions
修改件20.半导体器件的机械标准化.第2部分:尺寸
2018-04-12