JIS C 6485-2008
Base materials for printed circuits -- Paper base, phenolic resin
印制电路用基材纸基酚醛树脂
2008-01-01
MIL MIL-I-24768/11
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBG)
绝缘 塑料 层压 热固性 纸基 酚醛树脂（PBG）
1992-02-25
MIL MIL-I-24768/12
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBM)
绝缘 塑料 层压 热固性 纸基 酚醛树脂（PBM）
1992-02-25
MIL MIL-I-24768/12 Notice 1-Validation 1
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBM)
酚醛树脂（PBM）纸基层压热固性塑料绝缘材料
2020-03-09
MIL MIL-I-24768/11 Notice 1-Validation 1
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBG)
酚醛树脂（PBG）纸基层压热固性塑料绝缘材料
2020-03-09
MIL MIL-I-24768/10
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBE)
绝缘 塑料 层压 热固性 纸基 酚醛树脂（PBE）
1992-02-25
MIL MIL-I-24768/22
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBG-P)
纸基酚醛树脂（PBG-P）热固性层压塑料绝缘层
1992-02-25
MIL MIL-I-24768/20
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBM-PC)
绝缘 塑料 层压 热固性 纸基 酚醛树脂（PBM-PC）
1992-02-25
MIL MIL-I-24768/21
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBG-P)
纸基酚醛树脂（PBG-P）热固性层压塑料绝缘层
1992-02-25
MIL MIL-I-24768/23
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBE-PC)
绝缘 塑料 层压 热固性 纸基 酚醛树脂（PBE-PC）
1992-02-25
MIL MIL-I-24768/24
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBM-PF)
纸基酚醛树脂（PBM-PF）热固性层压塑料绝缘层
1992-02-25
MIL MIL-I-24768/19
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBM-P)
纸基酚醛树脂（PBM-P）热固性层压塑料绝缘材料
1992-02-25
MIL MIL-I-24768/25
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBE-PCF)
纸基酚醛树脂（PBE-PCF）热固性层压塑料绝缘层
1992-02-25
MIL MIL-I-24768/24 Notice 1-Validation 1
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBM-PF)
酚醛树脂（PBM-PF）纸基热固性层压塑料绝缘材料
2020-03-10
MIL MIL-I-24768/19 Notice 1-Validation 1
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBM-P)
酚醛树脂（PBM-P）纸基层压热固性塑料绝缘材料
2020-03-11
MIL MIL-I-24768/21 Notice 1-Validation 1
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBG-P)
酚醛树脂（PBG-P）纸基热固性层压塑料绝缘材料
2020-03-10
MIL MIL-I-24768/25 Notice 1-Validation 1
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBE-PCF)
酚醛树脂（PBE-PCF）纸基层压热固性塑料绝缘材料
2020-03-10
MIL MIL-I-24768/22 Notice 1-Validation 1
INSULATION, PLASTIC, LAMINATED, THERMOSETTING, PAPER-BASE, PHENOLIC-RESIN (PBG-P)
酚醛树脂（PBG-P）纸基热固性层压塑料绝缘材料
2020-03-10
GB/T 23100-2008
电气用热固性树脂工业硬质玻璃纤维缠绕管
Industrial rigid round winded tubes based on thermosetting resins for electrical purposes
2008-12-30
FED L-P-513C Notice 1-Validation
PLASTIC SHEET & INSULATION SHEET, ELECTRICAL (LAMINATED, THERMOSETTING, PAPER BASE, PHENOLIC RESIN) (SUPERSEDING L-P-513B) (S/S BY ASTM-D709-2001)
电气用塑料板和绝缘板（层压、热固性、纸基、酚醛树脂）（替代L-P-513B）（S/S根据ASTM-D709-2001）
1987-07-07