GB/T 11805-2019
水轮发电机组自动化元件（装置）及其系统基本技术条件
BS EN 62137-3-2012
Electronics assembly technology-Selection guidance of environmental and endurance test methods for solder joints
电子组装技术
2012-03-31
KS C IEC 62421(2017 Confirm)
전자부품 조립기술－전자 모듈
电子组装技术电子模块
2012-11-19
BS EN 62421-2007
Electronics assembly technology. Electronic modules
电子组装技术 电子模块
2007-12-31
KS C IEC 62421(2022 Confirm)
전자부품 조립기술－전자 모듈
电子组装技术－电子模块
2012-11-19
GOST R IEC 62421-2016
Технология электронного монтажа. Электронные модули
电子组装技术 电子模块
IEC 62421-2007
Electronics assembly technology - Electronic modules
电子组装技术.电子模块
2007-08-24
IPC 0040
Optoelectronics Assembly and Packaging Technology
光电子组装与封装技术
2003-05-01
IEC 60194-2-2025
Electronic assembly, design and circuit boards - Vocabulary - Part 2: Common usage in electronic technologies as well as electronic assembly technologies
电子组装、设计和电路板 词汇 第2部分:电子技术和电子组装技术中的常用
2025-02-12
KS C IEC TR 62878-2-9
부품내장 조립기술 — 제2-9부: 지침 — 전자조립기술 산업에서 JISSO Level의 개념
设备嵌入组装技术.第2-9部分:指南.电子组装技术行业中JISSO水平的概念
2024-10-30
IEC TR 62878-2-9-2022
Device embedding assembly technology - Part 2-9: Guidelines - Concept of JISSO level in the electronic assembly technology industries
设备嵌入组装技术.第2-9部分:指南.电子组装技术行业中JISSO水平的概念
2022-04-27
GB/T 2900.33-2004
电工术语 电力电子技术
Electrotechnical terminology--Power electronics
2004-05-10
DIN EN 62421
Electronics assembly technology - Electronic modules (IEC 62421:2007); German version EN 62421:2007
电子组装技术.电子模块（IEC 62421-2007）；德文版EN 62421:2007
2008-06-01
GB/T 19247.1-2003
印制板组装 第1部分:通用规范 采用表面安装和相关组装技术的电子和电气焊接组装的要求
Printed board assemblies--Part 1: Generic specification--Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
2003-07-02
KS C IEC 62137-3(2017 Confirm)
전자부품 조립기술－납땜접합에 대한 환경 및 내구성 시험방법 선택 안내
电子组装技术焊点环境和耐久性试验方法选择指南
2012-11-19
KS C IEC 60194-1
회로기판 설계, 제조 및 조립 — 용어 — 제1부: 회로기판 및 전자조립기술에서의 일반적인 사용
印制板设计、制造和组装词汇第1部分:印制板和电子组装技术中的通用
2024-11-26
IEC 60194-1-2021
Printed boards design, manufacture and assembly - Vocabulary - Part 1: Common usage in printed board and electronic assembly technologies
印制板设计、制造和组装词汇第1部分:印制板和电子组装技术中的通用
2021-02-09
KS C IEC 62137-3(2022 Confirm)
전자부품 조립기술－납땜접합에 대한 환경 및 내구성 시험방법 선택 안내
电子组装技术－焊点环境和耐久性试验方法的选择指南
2012-11-19
SJ/T 10584-1994
微电子学光掩蔽技术术语
Terms of photomasking technology for microelectronics
1994-08-08
GB/T 44928-2024
微电子学微光刻技术术语
Terms of microlithography technology for microelectronics
2024-12-31