YS/T 641-2024
半导体封装用键合铝丝
2024-10-24
YS/T 678-2024
半导体封装用键合铜丝
2024-10-24
GB/T 8750-2022
半导体封装用金基键合丝、带
Gold-based bonding wire and bandlet for semiconductor package
2022-12-30
T/ZZB 1718-2020
半导体封装用键合金丝
2020-09-30
T/ZZB 1718-2023
半导体封装用键合金丝
2024-11-14
DIN IEC 62047-9-DRAFT
Draft Document - Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 47/1947/CD:2007)
文件草稿.半导体器件.微机电器件.第9部分:MEMS用晶片间键合强度测量（IEC 47/1947/CD:2007）
2008-03-01
DIN EN 62047-9
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 62047-9:2011); German version EN 62047-9:2011
半导体器件.微机电器件.第9部分:MEMS用晶片间键合强度测量（IEC 62047-9-2011）；德文版EN 62047-9:2011
2012-03-01