SJ/T 2749-2016
半导体激光二极管测试方法
Measuring methods for semiconductor laser diodes
2016-01-15
GB/T 15649-1995
半导体激光二极管空白详细规范
Blank detail specification for semiconductor laser diodes
1995-07-24
GB/T 7581-1987
半导体分立器件外形尺寸
Dimensions of outlines for semiconductor discrete devices
1987-03-27
GB/T 7092-2021
半导体集成电路外形尺寸
Outline dimensions of semiconductor integrated circuits
2021-03-09
SJ 20957-2006
大功率半导体激光二极管阵列通用规范
General specification for large power semiconductor laser diode array
2006-08-07
SJ 50033/101-1995
ＧＪ１３２５型半导体激光二极管组件详细规范
Detail specification for semiconductor laser diode modules for type GJ1325
1996-06-14
SJ 50033/109-1996
半导体光电子器件GJ9031T、GJ9032T和GJ9034T型半导体激光二极管 详细规范
Semiconductor discrete device Detail specification for type GJ9032T and GJ9034T semiconductor laser diodes
JB/T 8175-1999
电力半导体器件用型材散热体外形尺寸
Outline dimensions of extruded heat sink for power semiconductor devices
1999-08-06
GOST 23448-1979
Диоды полупроводниковые инфракрасные излучающие. Основные размеры
半导体红外发射二极管 基本尺寸
MIL MIL-HDBK-6100
LIST OF CASE OUTLINES AND DIMENSIONS FOR DISCRETE SEMICONDUCTOR DEVICES (NO S/S DOCUMENT)
分立半导体器件外壳轮廓和尺寸清单（无S/S文件）
1997-07-30
MIL MIL-HDBK-6100 Notice 1-Cancellation
LIST OF CASE OUTLINES AND DIMENSIONS FOR DISCRETE SEMICONDUCTOR DEVICES (NO S/S DOCUMENT)
分立半导体器件的外壳外形和尺寸列表（无S/S文件）
2003-01-06
BS EN 60191-6-21-2010
Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)
半导体器件的机械标准化
2010-12-31
BS EN 60191-6-20-2010
Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ)
半导体器件的机械标准化
2010-12-31
BS EN 60191-6-10-2003
Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Dimensions of P-VSON
半导体器件的机械标准化
2004-03-31
IEC 60191-6-21-2010
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
半导体器件的机械标准化第6-21部分:表面贴装半导体器件封装外形图的一般规则 - 小外形封装（sop）封装尺寸的测量方法
2010-08-30
IEC 60191-6-20-2010
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
半导体器件的机械标准化 - 第6-20部分:表面贴装半导体器件封装外形图的一般规则 - 小型J型引线封装（Soj）封装尺寸测量方法
2010-08-30
UNE-EN 60191-6-10-2004
Mechanical standardization of semiconductor devices -- Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
半导体器件的机械标准化第6-10部分:表面安装半导体器件封装外形图绘制的一般规则P-VSON的尺寸
2004-05-28
IEC 60191-6-10-2003
Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON
半导体器件的机械标准化 - 第6-10部分:表面贴装半导体器件封装的外形图准备的一般规则 - P-Vson的尺寸
2003-11-19
BS 08/30190030 DC
BS EN 60191-6-21. Mechanical standardization of semiconductor devices. Part 6-21. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)
英国标准EN 60191-6-21 半导体器件的机械标准化 第6-21部分 表面安装半导体器件封装外形图绘制的一般规则 小外形包装的包装尺寸测量方法（SOP）
2008-12-01
BS EN 60191-6-4-2003
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Measuring methods for package dimensions of ball grid array (BGA)
半导体器件的机械标准化 表面安装半导体器件封装外形图绘制通则
2003-08-04