T/CPCA 6302-2021
挠性及刚挠印制电路板
2021-10-08
T/QGCML 4590-2024
高精度钻孔刚挠性印制电路板
2024-08-13
MIL MIL-P-50884D Notice 2-Amendment 2
PRINTED WIRING BOARD, FLEXIBLE OR RIGID-FLEX GENERAL SPECIFICATION FOR (SUPERSEDING MIL-P-50884C)
挠性或硬挠性印制电路板通用规范（代替MIL-P-50884C）
2006-05-29
QJ 1887A-2012
印制电路板照相底版技术要求
Technical requirement for artwork of printed circuit board
2013-01-04
QJ 1719-1989
印制电路板阻焊膜及字符标志技术条件
1989-02-22
QJ 20172-2012
印制电路板电镀纯锡技术要求
Technical requirement for puretin plating of printed circuit board
2013-01-04
QJ 2466A-2012
印制电路板热风整平技术要求
Technical requirement for hot air leveling of printed circuit board
2013-01-04
IPC TMRC99T
TMRC Technology Trends for Rigid Printed Wiring Boards
刚性印制电路板的TMRC技术趋势
2000-06-27
BS 6221-8-1982
Printed wiring boards-Method for specifying single and double sided flexible printed wiring boards with through connections
印刷线路板 带贯穿连接的单面和双面挠性印制电路板的规定方法
1982-10-29
T/CPCA 6044A-2025
印制电路板安全性 一般要求
2025-02-13
DB34/T 3365-2019
印制电路板可焊性测定 边浸法
2019-07-01
QJ 3015A-2012
印制电路板图形转移工艺技术要求
Technical requirements for printed circuit board pattern transfer
2013-01-04
QJ 3015-1998
印制电路板图形转移工艺技术要求
1998-02-06
QJ 1887-1990
印制电路板生产用照相底版的技术条件及制作方法
1990-01-20
T/CPCA 6045A-2017
高密度互连印制电路板技术规范
2017-10-09
T/CPCA 6045-2017
高密度互连印制电路板技术规范
Specification for High Density Interconnect Printed Circuit Board
2017-10-05
IPC 1131
Information Technology Guide for PWB Manufacturers
印制电路板制造商信息技术指南
2000-04-01
QJ 1462A-1999
印制电路板酸性光亮镀铜工艺技术要求
1999-02-14
QJ 2860A-2012
印制电路板孔金属化工艺技术要求
Technical requirement for hole metallization of printed circuit board
2013-01-04
QJ 1719A-2012
印制电路板阻焊膜及字符标志技术要求
Technical requirement for solder mask and legend mark of printed circuit board
2013-01-04