JB/T 12224-2015
屏蔽电机电泵 试验方法
Canned motor and pump - Test procedures
2015-04-30
HB 6-69-1975
飞机电机电器产品无线电传导干扰允许极限值及测量方法
1975-01-01
GOST R 59090-2020
Автомобильные транспортные средства. Изделия крепежные. Параметры затяжки. Упрощенный метод определения соотношения крутящего момента/угла поворота
电机电机 紧固件 收紧性能 扭矩/角度简化试验方法
GB/T 35856-2018
飞机电气设备绝缘电阻和耐电压试验方法
Methods of insulation resistance test and resistant high voltage test for aircraft electrical equipment
2018-02-06
T/CICEIA /CAMS82-2024
乘用车双电机混合动力机电耦合系统耐久试验方法
2024-03-04
IEC 62047-40-2021
Semiconductor devices - Micro-electromechanical devices - Part 40:Test methods of micro-electromechanical inertial shock switch threshold
半导体器件.微机电器件.第40部分:微机电惯性冲击开关阈值的试验方法
2021-09-03
IEC 62047-43-2024
Semiconductor devices - Micro-electromechanical devices - Part 43: Test method of electrical characteristics after cyclic bending deformation for flexible micro-electromechanical devices
半导体器件.微机电器件.第43部分:柔性微机电器件循环弯曲变形后电气特性的试验方法
2024-03-19
IEC 62047-22-2014
Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
半导体器件微机电器件第22部分:柔性衬底上导电薄膜的机电拉伸试验方法
2014-06-19
IEC 62047-29-2017
Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature
半导体器件 - 微机电器件 - 第29部分:室温下独立导电薄膜的机电弛豫试验方法
2017-11-22
IEC 62047-37-2020
Semiconductor devices - Micro-electromechanical devices - Part 37: Environmental test methods of MEMS piezoelectric thin films for sensor application
半导体器件微机电器件第37部分:传感器用MEMS压电薄膜的环境试验方法
2020-04-28
GB/T 38341-2019
微机电系统(MEMS)技术 MEMS器件的可靠性综合环境试验方法
Micro-electromechanical system technology—The reliability test methods of MEMS in integrated environments
2019-12-31
GB/T 44513-2024
微机电系统（MEMS）技术 传感器用MEMS压电薄膜的环境试验方法
Micro-electromechanical systems (MEMS) technology—Environmental test methods of MEMS piezoelectric thin films for sensor application
2024-09-29
IEC 62047-36-2019
Semiconductor devices – Micro-electromechanical devices – Part 36: Environmental and dielectric withstand test methods for MEMS piezoelectric thin films
半导体器件微机电器件第36部分:MEMS压电薄膜的环境和介电耐受试验方法
2019-04-05
KS C IEC 62047-18(2021 Confirm)
반도체 소자 ― 초소형 전기기계소자 ― 제18부: 박막 재료의 굽힘 시험방법
半导体器件微机电器件第18部分:薄膜材料弯曲试验方法
2016-12-29
KS C IEC 62047-22(2021 Confirm)
반도체 소자 ― 초소형 전기기계소자 ― 제22부: 유연 기판의 전도성 박막용 전기기계 인장 시험방법
半导体器件微机电器件第18部分:薄膜材料弯曲试验方法
2016-12-29
GB/T 41852-2022
半导体器件 微机电器件 MEMS结构黏结强度的弯曲和剪切试验方法
Semiconductor devices—Micro-electromechanical devices—Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
2022-10-12
IEC 62047-6-2009
Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
半导体器件 - 微机电器件 - 第6部分:薄膜材料的轴向疲劳试验方法
2009-04-07
IEC 62047-21-2014
Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials
半导体器件微机电器件第21部分:薄膜MEMS材料泊松比的试验方法
2014-06-19
DIN EN 62047-29-DRAFT
Draft Document - Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature (IEC 47F/243/CD:2016)
文件草稿-半导体器件-微机电器件-第29部分:室温下独立导电薄膜的机电松弛试验方法（IEC 47F/243/CD:2016）
2016-08-01
GB/T 21427-2008
特殊环境条件 干热沙漠对内燃机电站系统的技术要求及试验方法
Special environmental condition - Requirements and test methods for electric powerplant with internal combustion engines in dry heat-desert
2008-01-22