SJ 20203-1992
CTK4101型有可靠性指标的非密封多层片状瓷介固定电容器详细规范
Detail specification capacitors, chip, multiple layer, fixed, unencapsulated, ceramic dielectric, established reliability, type CTK4101
1992-11-19
SJ 20312-1993
CTK4102型有可靠性指标的非密封多层片状瓷介固定电容器详细规范
Detail specification capacitors, chip, multiple layer, fixed, unencapsulated, ceramic dielectric, established reliability Type CTK4102
1993-05-11
SJ 20313-1993
CTK4103型有可靠性指标的非密封多层片状瓷介固定电容器详细规范
Detail specification capacitors, chip, multiple layer, fixed, unencapsulated, ceramic dielectric, established reliability Type CTK4103
1993-05-11
SJ 20314-1993
CTK4104型有可靠性指标的非密封多层片状瓷介固定电容器详细规范
Detail specification capacitors, chip, multiple layer, fixed, unencapsulated, ceramic dielectric, established reliability Type CTK4104
1993-05-11
SJ 20318-1993
CCK4103型有可靠性指标的非密封多层片状瓷介固定电容器详细规范
Detail specification capacitors, chip, multiple layer, fixed, unencapsulated, ceramic dielectric, established reliability Type CCK4103
1993-05-11
DOD DOD-C-55681/11
CAPACITORS, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY STYLE CDR35 METRIC
已确立可靠性的陶瓷介质多层固定无封装片式电容器CDR35公制
1983-08-25
DOD DOD-C-55681/10
CAPACITORS, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY STYLE CDR34 METRIC(NO S/S DOCUMENT)
固定式、非封装陶瓷介质多层片式电容器 已确立的可靠性类型CDR34公制（无S/S文件）
1983-08-25
DOD DOD-C-55681/9
CAPACITORS, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY STYLE CDR33 METRIC(NO S/S DOCUMENT)
固定式、非封装、陶瓷介质多层片式电容器 已确立的可靠性类型CDR33公制（无S/S文件）
1983-08-25
DOD DOD-C-55681/8
CAPACITORS, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY STYLE CDR32 METRIC(NO S/S DOCUMENT)
固定式、非封装、陶瓷介质多层片式电容器 已确立的可靠性类型CDR32公制（无S/S文件）
1983-08-25
MIL MIL-C-55681D
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR (SUPERSEDING MIL-C-55681C) (S/S BY MIL-PRF-55681E)
已确立可靠性的多层固定无封装陶瓷介质片式电容器（取代MIL-C-55681C）（由MIL-PRF-55681E提供）
1994-07-13
MIL MIL-C-55681D Supplement 1
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR (SUPERSEDING MIL-C-55681C) (S/S BY MIL-PRF-55681E)
已确定可靠性的多层固定、未封装陶瓷电介质芯片电容器（取代MIL-C-55681C）的通用规范
1994-07-13
MIL MIL-PRF-55681G Supplement 1
Capacitor, Chip, Multiple Layer, Fixed Ceramic Dielectric, Established Reliability and Non-Established Reliability, General Specification for
确定可靠性和非确定可靠性的多层固定陶瓷电介质芯片电容器通用规范
2016-07-12
MIL MIL-PRF-55681G
Capacitor, Chip, Multiple Layer, Fixed Ceramic Dielectric, Established Reliability and Non-Established Reliability, General Specification for
片式多层固定陶瓷电介质电容器 既有可靠性和非既有可靠性 通用规范
2016-07-12
MIL MIL-C-55681/6 Notice 1-Validation
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, STYLES CDR26, CDR27, CDR28, CDR29, AND CDR30 (S/S BY MIL-PRF-55681/6A)
电容器 芯片 多层 固定 未封装 陶瓷电介质 建立可靠性 样式CDR26 CDR27 CDR28 CDR29和CDR30（S/S BY MIL-PRF-55681/6A）
1989-06-05
MIL MIL-C-55681/6
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, STYLES CDR26, CDR27, CDR28, CDR29, AND CDR30 (S/S BY MIL-PRF-55681/6A)
电容器 片式 多层 固定 未封装 陶瓷介质 可靠 型号CDR26 CDR27 CDR28 CDR29和CDR30（S/S由MIL-PRF-55681/6A提供）
1981-07-30
MIL MIL-C-55681/6 Amendment 1
CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, STYLES CDR26, CDR27, CDR28, CDR29, AND CDR30 (S/S BY MIL-PRF-55681/6A)
电容器 芯片 多层 固定的 未封装的 陶瓷电介质 已建立的可靠性 型号CDR26 CDR27 CDR28 CDR29和CDR30（由MIL-PRF-55681/6A制成）
1991-04-01
MIL MIL-C-55681/4B Amendment 7
CAPACITORS, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, STYLES CDR11, CDR12, CDR13, AND CDR14 (HIGH FREQUENCY) (S/S BY MIL-C-55681/4C)
多层固定无封装陶瓷介质芯片电容器 可靠性高 CDR11、CDR12、CDR13和CDR14（高频）（MIL-C-55681/4C标准S/S）
1985-10-07
MIL MIL-C-55681/7A Notice 1-Validation
CAPACITORS, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, STYLE CDR31, METRIC (SUPERSEDING MIL-C-55681/7) (S/S BY MIL-PRF-55681/7B)
芯片电容器 多层 固定的 未封装的 陶瓷电介质 已建立的可靠性 CDR31型 公制（取代MIL-C-55681/7）（S/S BY MIL-PRF-55681/7B）
1994-11-15
MIL MIL-C-55681/11A Notice 1-Validation
CAPACITORS, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, STYLE CDR35, METRIC (SUPERSEDING MIL-C-55681/11) (S/S BY MIL-PRF-55681/11B)
芯片电容器 多层 固定的 未封装的 陶瓷电介质 已建立的可靠性 CDR35型 公制（取代MIL-C-55681/11）（S/S BY MIL-PRF-55681/11B）
1994-11-15
MIL MIL-C-55681/9A Notice 1-Validation
CAPACITORS, CHIP, MULTIPLE LAYER, FIXED, UNENCAPSULATED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY, STYLE CDR33, METRIC (SUPERSEDING MIL-C-55681/9) (S/S BY MIL-PRF-55681/9B)
已确定可靠性的多层固定无封装陶瓷介质片式电容器 CDR33型 公制（取代MIL-C-55681/9）（由MIL-PRF-55681/9B提供）
1994-11-15