BS EN 60249-2-4-1994
Specifications-Specification for epoxide woven glass fabric copper-clad laminated sheet, general purpose grade-Specification No. 4: Epoxide woven glass fabric copper-clad laminated sheet, general purpose grade
规格
2001-04-15
GB/T 4725-2022
印制电路用覆铜箔环氧玻纤布层压板
Epoxide woven glass fabric copper-clad laminated sheets for printed circuits
2022-03-09
BS EN 60249-2-11-1994
Specifications-Specification for thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards
规格
2001-06-15
GB/T 12630-1990
一般用途的薄覆铜箔环氧玻璃布层压板 （制造多层印制板用）
Thin epoxide woven glass fabric copper-clad laminated sheet， general purpose grade， for use in the fabrication of multilayer printed boards
1990-12-28
BS EN 60249-2-10-1994
Specifications-Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test)
规格
2001-06-01
BS EN 60249-2-18-1993
Specifications-Specification No. 18. Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
规格
2001-06-15
BS EN 60249-2-19-1993
Specifications-Specification No. 19. Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
规格 第19号规范 用于制造多层印制板的规定可燃性的双马来酰亚胺/三嗪改性环氧玻璃纤维织物覆铜薄层压板
1992-09-15
UNE-EN 60249-2-4-1996
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº4: EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE.
印刷电路的基材 第2部分:规范 规范4:通用级环氧玻璃纤维织物覆铜层压板
1996-11-07
UNE-EN 60249-2-4/A3-1996
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº4: EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE.
印刷电路的基材 第2部分:规范 规范4:通用级环氧玻璃纤维织物覆铜层压板
1996-11-07
UNE-EN 60249-2-4/A4-1996
BASE MATERIAL FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 4: EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE.
印刷电路的基材 第2部分:规范 规范4:通用级环氧玻璃纤维织物覆铜层压板
1996-11-07
UNE-EN 60249-2-5-1996
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº5: EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST).
印刷电路的基材 第2部分:规范 规范5:规定可燃性的环氧玻璃纤维织物覆铜层压板（垂直燃烧试验）
1996-11-07
UNE-EN 60249-2-12-1996
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 12: THIN EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY, FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
印刷电路的基材 第2部分:规范 规范12:多层印制板制造用规定可燃性的薄环氧玻璃纤维织物覆铜层压板
1996-07-24
KS C IEC 60249-2-11(2017 Confirm)
인쇄 회로 기판 재료－제2부：규격－ 제11장：다층 인쇄 회로 기판 제조용 일반 등급의 박막 에폭시 유리 섬유 직물 동 입힘 적층판
印制电路用基材第2部分:第11号规范:多层印制板制造用通用级薄环氧玻璃纤维布覆铜层压板
2002-08-31
JIS C 6492-1998
Base materials for printed circuits -- Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
印制电路用基材规定可燃性的双马来酰亚胺/三嗪改性环氧玻璃布覆铜层压板（垂直燃烧试验）
1998-01-01
JIS C 6494-1999
Base materials for printed circuits -- Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
印制电路用基材多层印制板制造用规定可燃性的双马来酰亚胺/三嗪改性环氧玻璃纤维织物覆铜薄层压板
1999-01-01
UNE-EN 60249-2-11-1996
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 11: THIN EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE, FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
印刷电路的基材 第2部分:规范 规范11:用于制造多层印制板的通用级薄环氧玻璃纤维织物覆铜层压板
1996-07-24
BS EN 60249-2-16-1993
Specifications-Specification No. 16. Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
规格
2001-06-15
BS EN 60249-2-17-1993
Specifications-Specification No. 17. Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
规格
2001-06-15
BS 4584-13-1977
Specification for metal-clad base materials for printed circuits-Silicone woven glass fabric copper-clad laminated sheet Si-GC-Cu-13
印制电路用金属覆层基材规范 硅机织玻璃纤维覆铜层压板Si-GC-Cu-13
1977-11-30
UNE-EN 60249-2-19/A1-1997
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
印刷电路的基材 第2部分:规范 规范19:多层印制板制造用规定可燃性的双马来酰亚胺/三嗪改性环氧编织玻璃纤维覆铜薄层压板
1997-10-17