T/CPCA /JPCA 4306-2011
印制板用阻焊剂
Solder resists for printed boards
2011-03-15
SJ/T 10309-2016
印制板用阻焊剂
Solder resists for printed boards
2016-01-15
BS 6221-25-2000
Printed wiring boards-Guide to the rework and repair of soldered surface mounted printed board assemblies
印刷线路板 焊接表面安装印刷电路板组件的返工和修理指南
2000-11-15
NAS 980
Printed Circuit Board Soldering Machine Automatically Controlled
印刷电路板自动焊接机
1975-09-15
VDI/VDE 3710 Sheet 5
Manufacturing of printed circuit boards; conservation of soldering properties
印刷电路板制造；焊接性能的保护
1993-06-01
SJ/Z 21088-2016
印制板阻焊膜加工指南
Guide for solder mask processing of printed circuit boards
2016-01-19
IPC TR-460A
Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards
波峰焊印制电路板故障排除清单
1984-02-01
GOST R 54849-2011
Маска паяльная защитная для печатных плат. Общие технические условия
印刷电路板用保护性阻焊剂 一般规格
BS 4584-103.3-1992
Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits-Specification for permanent polymer coating materials (solder resist) for use in the fabrication of printed boards
印制线路板用金属覆层基材 与印刷电路有关的特殊材料 印制板制造用永久性聚合物涂层材料（阻焊剂）规范
1992-03-31
BS EN IEC 61189-5-601-2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies-General test methods for materials and assemblies. Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
电气材料、印制板和其他互连结构和组件的试验方法
2021-03-19
EIA 364-61
Resistance to Soldering Heat from Rework Test Procedure for Electrical Connectors and Sockets Mounted on Printed Circuit Boards
印刷电路板上安装的电气连接器和插座的返工试验程序产生的耐焊接热
2014-05-01
QJ 1719A-2012
印制电路板阻焊膜及字符标志技术要求
Technical requirement for solder mask and legend mark of printed circuit board
2013-01-04
BS EN 61191-4-2017
Printed board assemblies-Sectional specification. Requirements for terminal soldered assemblies
印制板组件
2017-11-20
SJ/Z 21090-2016
印制板热风整平指南
Guide for hot air solder level processing of printed circuit boards
2016-01-19
BS PD IEC TR 61191-8-2021
Printed board assemblies-Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
印制板组件
2021-03-25
GB/T 12631-2017
印制板导线电阻测试方法
Test method for resistance of conductor of printed boards
2017-05-31
IEC 61189-5-601-2021
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
电气材料、印制板和其他互连结构和组件的试验方法第5-601部分:材料和组件的一般试验方法焊点的回流焊接能力试验和印制板的回流耐热试验
2021-02-03
MIL MIL-DTL-21097/17E Notice 1-Validation
Connectors, Electrical, Printed Wiring Board Contact, Solder, Removable, Type CR
CR型可拆卸焊料印刷线路板触点电气连接器
2010-05-26
IPC TR-462
Solderability Evaluation of Printed Boards with Protective Coatings Over Long Term Storage
具有保护涂层的印制板在长期贮存期间的可焊性评估
1987-10-01
MIL MIL-DTL-21097/17E Notice 2-Validation
Connectors, Electrical, Printed Wiring Board Contact, Solder, Removable, Type CR
CR型可拆卸焊料印刷线路板触点电气连接器
2015-04-03