DL/T 485-2018
电力企业标准体系表编制导则
Guide for preparing diagrams of electric power enterprise standard system
2018-04-03
BS EN 60191-6-1-2001
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Design guide for gull-wing lead terminals
半导体器件的机械标准化 表面安装半导体器件封装外形图绘制通则
2002-03-29
BS EN 60191-6-18-2010
Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)
半导体器件的机械标准化
2010-10-31
BS EN 60191-6-5-2001
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Design guide for fine-pitchball grid array (FBGA)
半导体器件的机械标准化 表面安装半导体器件封装外形图绘制通则
2001-11-15
BS 04/30114936 DC
EN 50439. Railway applications. Reliability tests for high power semiconductors devices. Part 1. Standard base-plate modules
EN 50439 铁路应用 大功率半导体器件的可靠性试验 第一部分 标准基板模块
2004-06-09
UNE-EN 60191-6-1-2002
Mechanical standardization of semiconductor devices -- Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals.
半导体器件的机械标准化第6-1部分:表面安装半导体器件封装外形图绘制的一般规则鸥翼引线端子的设计指南
2002-06-28
BS EN 60191-6-8-2001
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Design guide for glass sealed ceramic quad flatpack (G-QFP)
半导体器件的机械标准化 表面安装半导体器件封装外形图绘制通则
2001-11-16
IEC 60191-6-18-2010
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
半导体器件的机械标准化 - 第6-18部分:表面安装半导体器件封装外形图的准备通则 - 球栅阵列（BGA）设计指南
2010-01-07
IEC 60191-6-1-2001
Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
半导体器件的机械标准化 - 第6-1部分:表面贴装半导体器件封装外形图的一般规则 - 鸥翼引线端子设计指南
2001-10-30
UNE-EN 60191-6-6-2002
Mechanical standardization of semiconductor devices -- Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA).
半导体器件的机械标准化第6-6部分:表面安装半导体器件封装外形图绘制的一般规则细间距栅极阵列（FLGA）设计指南
2002-03-21
UNE-EN 60191-6-5-2002
Mechanical standardization of semiconductor devices -- Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device package - Design guide for fine -pitch ball grid array (FBGA).
半导体器件的机械标准化第6-5部分:表面安装半导体器件封装外形图绘制的一般规则细间距球栅阵列（FBGA）设计指南
2002-06-28
BS EN 60191-6-6-2001
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Design guide for fine pitch land grid array (FLGA)-Proposed amendment on terminology
半导体器件的机械标准化 表面安装半导体器件封装外形图绘制通则
2001-09-05
IEC 60191-6-5-2001
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
半导体器件的机械标准化 - 第6-5部分:表面贴装半导体器件封装外形图的一般规则 - 细间距球栅阵列设计指南（fbga）
2001-08-27
IEC 60191-6-6-2001
Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
半导体器件的机械标准化.第6-6部分:表面安装半导体器件封装外形图制备的一般规则.细间距陆地栅格阵列（FLGA）设计指南
2001-03-22
UNE-EN 60191-6-8-2002
Mechanical standardization of semiconductor devices -- Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP).
半导体器件的机械标准化第6-8部分:表面安装半导体器件封装外形图绘制的一般规则玻璃密封陶瓷四边形扁平封装（G-QFP）的设计指南
2002-06-28
IEC 60191-6-8-2001
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
半导体器件的机械标准化.第6-8部分:表面安装半导体器件封装外形图绘制的一般规则.玻璃密封陶瓷方形扁平封装（G-QFP）的设计指南
2001-08-27
UNE-EN 60191-6-12-2004
Mechanical standardization of semiconductor devices -- Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type
半导体器件的机械标准化第6-12部分:表面安装半导体器件封装外形图绘制的一般规则细间距栅极阵列（FLGA）设计指南矩形
2004-03-26
BS EN 60191-6-2-2002
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
半导体器件的机械标准化 表面安装半导体器件封装外形图绘制通则
2003-03-04
BS 08/30175763 DC
BS EN 60191-6-18. Mechanical standardization of semiconductor devices. Part 6-18. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)
英国标准EN 60191-6-18 半导体器件的机械标准化 第6-18部分 表面安装半导体器件封装外形图绘制的一般规则 球栅阵列（BGA）设计指南
2008-01-03
BS 10/30227781 DC
BS EN 60191-6-1. Mechanical standardization of semiconductor devices. Part 6-1. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for gull-wing lead terminals
英国标准EN 60191-6-1 半导体器件的机械标准化 第6-1部分 表面安装半导体器件封装外形图绘制的一般规则 鸥翼引线端子设计指南
2010-05-06