BS 123300-2001
System of quality assessment. Sectional specification. Rigid multilayer printed boards
质量评估体系 分规范 刚性多层印制板
2001-12-17
BS 123300-003-2001
System of quality assessment. Capability detail specification. Rigid multilayer printed boards
质量评估体系 能力详细说明 刚性多层印制板
2001-12-17
BS 123800-2001
System of quality assessment. Sectional specification. Flexible multilayer printed boards with through-connections
质量评估体系 分规范 具有贯穿连接的挠性多层印制板
2001-12-17
GOST 23661-1979
Платы печатные многослойные. Требования к типовому технологическому процессу прессования
多层印刷电路板 对标准技术压制过程的要求
BS EN 123300-1992
Specification for harmonized system of quality assessment for electronic components. Sectional specification. Multilayer printed boards
电子元件质量评定协调体系规范 分规范 多层印制板
1989-08-31
BS 123800-003-2001
System of quality assessment. Capability detail specification. Flexible multilayer printed boards with through-connections
质量评估体系 能力详细说明 具有贯穿连接的挠性多层印制板
2001-12-17
BS 123600-2001
System of quality assessment. Sectional specification. Flex-rigid multilayer printed boards with through-connections
质量评估体系 分规范 带贯穿连接的软硬多层印制板
2001-12-17
BS CECC 23300-003-1996
Harmonized system of quality assessment for electronic components. Capability detail specification: multilayer printed boards
电子元件质量评定协调体系 能力详细规范:多层印制板
1996-04-15
BS 123600-003-2001
System of quality assessment. Capability detail specification. Flex-rigid multilayer printed boards with through-connections
质量评估体系 能力详细说明 带贯穿连接的软硬多层印制板
2001-12-17
NASA GSFC-STD-8001
Standard Quality Assurance Requirements for Printed Circuit Boards
印刷电路板的标准质量保证要求
2019-11-21
BS EN 123800-1997
Harmonized system of quality assessment for electronic components. Sectional specification. Flexible multilayer printed boards with through connections
电子元件质量评定协调体系 分规范 具有贯穿连接的挠性多层印制板
1997-05-15
BS EN 123600-1997
Harmonized system of quality assessment for electronic components. Sectional specification. Flex-rigid multilayer printed boards with through connections
电子元件质量评定协调体系 分规范 带贯穿连接的软硬多层印制板
1997-05-15
BS CECC 23800-801-1998
Harmonized system of quality assessment for electronic components. Capability detail specification: flexible multilayer printed boards with through connections
电子元件质量评定协调体系 能力详细规范:带贯穿连接的挠性多层印制板
1998-06-15
GB/T 12630-1990
一般用途的薄覆铜箔环氧玻璃布层压板 （制造多层印制板用）
Thin epoxide woven glass fabric copper-clad laminated sheet， general purpose grade， for use in the fabrication of multilayer printed boards
1990-12-28
BS CECC 23600-801-1998
Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid multilayer printed boards with through connections
电子元件质量评定协调体系 能力详细规范:带贯穿连接的挠性-刚性多层印制板
1998-06-15
BS EN 60249-2-11-1994
Specifications-Specification for thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards
规格
2001-06-15
KS C IEC 60249-2-11(2017 Confirm)
인쇄 회로 기판 재료－제2부：규격－ 제11장：다층 인쇄 회로 기판 제조용 일반 등급의 박막 에폭시 유리 섬유 직물 동 입힘 적층판
印制电路用基材第2部分:第11号规范:多层印制板制造用通用级薄环氧玻璃纤维布覆铜层压板
2002-08-31
UNE-EN 60249-2-11-1996
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 11: THIN EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE, FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
印刷电路的基材 第2部分:规范 规范11:用于制造多层印制板的通用级薄环氧玻璃纤维织物覆铜层压板
1996-07-24