T/CPCA 1201-2009
印制板的包装、运输和保管
Packaging, handling and storage for printed boards
2009-03-16
SJ 21082-2016
印制板的包装和贮存
Packaging and storage for printed circuit boards
2016-01-19
GB/T 32792-2016
"Packaging,marking,transporting and storing of magnesium alloy wrought products"
2016-08-29
SN/T 0806-1999
出口商品运输包装 蜂窝纸板托盘包装检验规程
Rules for the inspection of transport packaging for export commodities—Honeycomb board pallet
1999-12-01
MIL MIL-I-81969/26A
INSTALLING AND REMOVAL TOOLS, CONNECTOR ELECTRICAL CONTACT, TYPE II, CLASS 1 OR 2, COMPOSITION A, (FOR REMOVAL OF INTEGRATED CIRCUIT PACKAGES AND SIMILAR DEVICES FROM SOCKETS, RECEPTACLES, OR PRINTED WIRING BOARDS) (SUPERSEDING MIL-I-81969/26)
安装和拆卸工具 连接器电触点 II型 1类或2类 成分A （用于从插座、插座或印刷线路板上拆卸集成电路封装和类似设备）（代替MIL-I-81969/26）
1978-03-16
MIL MIL-I-81969/26A Amendment 1
INSTALLING AND REMOVAL TOOLS, CONNECTOR ELECTRICAL CONTACT, TYPE II, CLASS 1 OR 2, COMPOSITION A, (FOR REMOVAL OF INTEGRATED CIRCUIT PACKAGES AND SIMILAR DEVICES FROM SOCKETS, RECEPTACLES, OR PRINTED WIRING BOARDS) (SUPERSEDING MIL-I-81969/26)
安装和拆卸工具 连接器电触点 II型 1级或2级 成分A（用于从插座、插座或印刷线路板上拆卸集成电路封装和类似设备）（替代MIL-I-81969/26）
1991-06-26
BS 11/30252443 DC
BS EN 62326-15. Printed boards. Device Embedded Substrate. General elect rical test guide for device embedded substrate with active devices, pass ive components (capacitor, resistor, inductor, etc), integratedpassive d evice (IPD), and discrete packages
英国标准EN 62326-15 印制板 设备嵌入基板 带有有源器件、通电元件（电容器、电阻器、电感器等）、集成无源器件（IPD）和分立封装的器件嵌入式基板的通用电气测试指南
2011-08-30
DIN EN 62326-15-DRAFT
Draft Document - Printed boards - Device Embedded Substrate - General electrical test guide for device embedded substrate with active devices, passive components (Capacitor, Resistor, Inductor, etc), Integrated passive device (IPD), and discrete packages (IEC 91/995/CD:2011)
文件草案——印制板——设备嵌入式基板——带有源器件、无源元件（电容器、电阻器、电感器等）、集成无源器件（IPD）和分立封装的设备嵌入式基板的通用电气试验指南（IEC 91/995/CD:2011）
2012-01-01