Environmental testing: Tests -- Test: Test methods for solderability of surface mounting devices (SMD) by wetting balance using lead-free solder paste
环境试验:试验——试验:用无铅焊膏润湿平衡法测定表面安装器件(SMD)可焊性的试验方法
2005-01-01
ASTM D8597-24
Standard Test Method for Surface Wettability of Coatings, Substrates, and Pigments by Contact Angle Measurement Using Portable Goniometers
用便携式测角仪测量接触角测定涂料、基材和颜料表面润湿性的标准试验方法