SJ/T 11081-1996
阴极射线管外形图的绘制
Preparation of outline drawings of cathode-ray tubes
1996-11-20
ECA/EIA 202
RECOMMENDED PRACTICE FOR PREPARATION OF OUTLINE DRAWINGS OR ELECTRON TUBES
电子管外形图的编制推荐规程
1979-12-01
BS EN 60139-2001
Preparation of outline drawings for cathode-ray tubes, their components, connections and gauges
阴极射线管及其部件、连接件和量规外形图的绘制
2001-08-15
IEC 60139-2000
Preparation of outline drawings for cathode-ray tubes, their components, connections and gauges
阴极射线管及其部件、连接件和量规外形图的编制
2000-12-21
BS EN 60191-3-2000
Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of integrated circuits
半导体器件的机械标准化 集成电路外形图绘制通则
2000-06-15
DIN EN 60139
Preparation of outline drawings for cathode-ray tubes, their components, connections and gauges (IEC 60139:2000); German version EN 60139:2001
阴极射线管及其部件、连接件和量规外形图的绘制（IEC 60139-2000）；德文版EN 60139:2001
2001-10-01
SJ/Z 9021.3-1987
半导体器件的机械标准化 第3部分:集成电路外形图绘制总则
Mechanical standardization of semiconductor devices Part 3: General rules for the preparation of outline drawings of integrated circuits
1987-09-14
UNE-EN 60191-3-2001
Mechanical standardization of semiconductor devices -- Part 3: General rules for the preparation of outline drawings of integrated circuits.
半导体器件机械标准化第3部分:集成电路外形图绘制通则
2001-01-31
KS C IEC 61240
압전 소자 — 주파수 제어 및 선택용 표면 실장 소자(SMD)의 개략도 — 일반 규정
压电器件频率控制用表面安装器件（SMD）外形图的制备及选用通则
2018-03-23
KS C IEC 61240(2023 Confirm)
압전 소자 — 주파수 제어 및 선택용 표면 실장 소자(SMD)의 개략도 — 일반 규정
压电器件.频率控制和选择用表面安装器件（SMD）外形图的制备.总则
2018-03-23
IEC 60191-3-1999
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
半导体器件的机械标准化.第3部分:集成电路外形图编制的一般规则
1999-10-29
IEC 60191-1-2018
Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
半导体器件的机械标准化 - 第1部分:分立器件外形图准备的一般规则
2018-01-23
BS EN 61240-2017
Piezoelectric devices. Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection. General rules
压电设备 为频率控制和选择准备表面安装设备（SMD）的外形图 一般规则
2017-01-31
IEC 61240-2016
Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules
压电器件.频率控制和选择用表面安装器件（SMD）外形图的制备.总则
2016-10-24
BS EN 60191-6-21-2010
Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)
半导体器件的机械标准化
2010-12-31
IEC 60191-6-2009
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
半导体器件机械标准化 - 第6部分:表面贴装半导体器件封装外形图准备的一般规则
2009-11-26
BS EN 60191-6-20-2010
Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ)
半导体器件的机械标准化
2010-12-31
BS EN 60191-6-10-2003
Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Dimensions of P-VSON
半导体器件的机械标准化
2004-03-31
IEC 60191-6-21-2010
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
半导体器件的机械标准化第6-21部分:表面贴装半导体器件封装外形图的一般规则 - 小外形封装（sop）封装尺寸的测量方法
2010-08-30
BS 05/30129010 DC
IEC 60191-1 ED.2. Mechanical standardization of semiconductor devices. Part 1. General rules for the preparation of outline drawings of discrete devices
IEC 60191-1第2版 半导体器件的机械标准化 第一部分 分立器件外形图绘制通则
2005-02-09