ASTM B506-22
Standard Specification for Copper-Clad Stainless Steel Sheet and Strip for Building Construction
建筑结构用覆铜不锈钢薄板和带材的标准规范
2022-05-01
BS 4584-103.2-1990
Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits-Specification for copper foil for use in the manufacture of copper-clad base materials
印制线路板用金属覆层基材 与印刷电路有关的特殊材料 覆铜基材制造用铜箔规范
1990-02-28
BS 4584-13-1977
Specification for metal-clad base materials for printed circuits-Silicone woven glass fabric copper-clad laminated sheet Si-GC-Cu-13
印制电路用金属覆层基材规范 硅机织玻璃纤维覆铜层压板Si-GC-Cu-13
1977-11-30
BS 4584-5-1972
Specification for metal-clad base materials for printed circuits-Phenolic cellulose paper copper-clad laminated sheet of medium electrical quality: PF-CP-Cu-5
印制电路用金属覆层基材规范 中等电气质量酚醛纤维素纸覆铜层压板:PF-CP-Cu-5
1972-07-28
BS 4584-6-1972
Specification for metal-clad base materials for printed circuits-Phenolic cellulose paper copper-clad laminated sheet of medium electrical quality, flame retardant grade: PF-CP-Cu-6
印制电路用金属覆层基材规范 阻燃级中等电气质量酚醛纤维素纸覆铜层压板:PF-CP-Cu-6
1972-07-28
KS C IEC 60249-2-11(2017 Confirm)
인쇄 회로 기판 재료－제2부：규격－ 제11장：다층 인쇄 회로 기판 제조용 일반 등급의 박막 에폭시 유리 섬유 직물 동 입힘 적층판
印制电路用基材第2部分:第11号规范:多层印制板制造用通用级薄环氧玻璃纤维布覆铜层压板
2002-08-31
KS C IEC 60249-2-7(2017 Confirm)
인쇄 회로 기판 재료－ 제2부：규격－제7장：가연성 페놀셀룰로오스 종이 동입힘 적층판 (수직 연소 시험)
印制电路用基材第2部分:规范第7号规范:规定可燃性的酚醛纤维素纸覆铜层压板（垂直燃烧试验）
2002-05-30
UNE-EN 60249-2-12-1996
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 12: THIN EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY, FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
印刷电路的基材 第2部分:规范 规范12:多层印制板制造用规定可燃性的薄环氧玻璃纤维织物覆铜层压板
1996-07-24
UNE-EN 60249-2-17-1997
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 17: THIN POLYIMIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARD.
印刷电路的基材 第2部分:规范 规范Nº17:多层印制板制造用规定可燃性的薄聚酰亚胺编织玻璃纤维覆铜层压板
1997-08-11
UNE-EN 60249-2-19/A1-1997
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
印刷电路的基材 第2部分:规范 规范19:多层印制板制造用规定可燃性的双马来酰亚胺/三嗪改性环氧编织玻璃纤维覆铜薄层压板
1997-10-17
UNE-EN 60249-2-19/A2-1997
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
印刷电路的基材 第2部分:规范 规范19:多层印制板制造用规定可燃性的双马来酰亚胺/三嗪改性环氧编织玻璃纤维覆铜薄层压板
1997-10-17
UNE-EN 60249-2-19-1997
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
印刷电路的基材 第2部分:规范 规范19:多层印制板制造用规定可燃性的双马来酰亚胺/三嗪改性环氧编织玻璃纤维覆铜薄层压板
1997-08-11