SAE ARP1332D
Wave Soldering Procedure
波峰焊接程序
2013-08-12
EIA 364-71
Solder Wicking (Wave Solder Technique) Test Procedure for Electrical Connectors and Sockets
电连接器和插座的焊料芯吸（波焊技术）试验程序
2008-05-01
ECA SP 5148
SOLDER WICKING (WAVE SOLDER TECHNIQUE) TEST PROCEDURE FOR ELECTRICAL CONNECTORS AND SOCKETS
电连接器和插座的焊料芯吸（波焊技术）试验程序
2007-02-05
SME EE00-140
Parylene Conformal Coating Compatibility Evaluation With No-Clean Solder Pastes, Wave Solder Fluxes And Flux Cored Wire Solders
Parylene保形涂层与无清洁锡膏、波形焊剂和药芯焊丝焊料的相容性评估
2000-11-01
IPC TR-460A
Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards
波峰焊印制电路板故障排除清单
1984-02-01
IPC 7530A
Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow and Wave)
大规模焊接工艺（回流焊和波峰焊）的温度分布指南
2017-02-28
DIN EN 14612
Space product assurance - Verification and approval of automatic machine wave soldering
航天产品保证——自动波峰焊的验证和批准；德文版EN 14612:2003
2004-05-01
BS EN 62739-3-2017
Test method for erosion of wave soldering equipment using molten lead-free solder alloy-Selection guidance of erosion test methods
使用熔融无铅焊料合金的波峰焊设备腐蚀的试验方法
2017-04-30
IPC J-STD-005A
Requirements for Soldering Pastes
锡膏的要求
2012-02-01
BS EN 62739-2-2016
Test method for erosion of wave soldering equipment using molten lead-free solder alloy-Erosion test method for metal materials with surface processing
使用熔融无铅焊料合金的波峰焊设备腐蚀的试验方法
2016-10-31
IEC 62739-3-2017
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
使用熔融无铅焊料合金的波峰焊设备腐蚀试验方法第3部分:侵蚀试验方法的选择指导
2017-01-06
BS EN 62739-1-2013
Test method for erosion of wave soldering equipment using molten lead-free solder alloy-Erosion test method for metal materials without surface processing
使用熔融无铅焊料合金的波峰焊设备腐蚀的试验方法
2013-09-30
NASA NHB 5300.4(3A-2)
Requirements for Soldered Electrical Connections
焊接电气连接的要求
1992-01-01
IPC 7527
Requirements for Solder Paste Printing
锡膏印刷要求
2012-05-01
NHB 5300.4(3A-1)
Requirements for Soldered Electrical Connections
焊接电气连接的要求
1992-01-01
SJ 21374-2018
高可靠行波管慢波组件夹持工艺控制要求
Process control requirements for slow-wave component clamping of high reliability traveling-wave-tube
2018-01-18
IPC J-STD-006B
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
电子焊接用电子级焊料合金、助焊剂和非助焊剂的要求
2006-01-01
IEC 62739-2-2016
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
使用熔融无铅钎料合金的波峰焊接设备的腐蚀试验方法 - 第2部分:表面处理金属材料的腐蚀试验方法
2016-07-13
IEC 62739-1-2013
Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
使用熔融无铅焊料合金的波峰焊设备腐蚀试验方法 - 第1部分:无表面处理金属材料的侵蚀试验方法
2013-06-18
IPC J-STD-001H
Requirements for Soldered Electrical and Electronic Assemblies
焊接电气和电子组件的要求
2020-09-01