半导体分立器件外形尺寸
Dimensions of outlines for semiconductor discrete devices
1987-03-27
MIL MIL-HDBK-6100
LIST OF CASE OUTLINES AND DIMENSIONS FOR DISCRETE SEMICONDUCTOR DEVICES (NO S/S DOCUMENT)
分立半导体器件外壳轮廓和尺寸清单（无S/S文件）
1997-07-30
MIL MIL-HDBK-6100 Notice 1-Cancellation
LIST OF CASE OUTLINES AND DIMENSIONS FOR DISCRETE SEMICONDUCTOR DEVICES (NO S/S DOCUMENT)
分立半导体器件的外壳外形和尺寸列表（无S/S文件）
2003-01-06
BS EN 60191-6-20-2010
Mechanical standardization of semiconductor devices-General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ)
半导体器件的机械标准化
2010-12-31
IEC 60191-6-20-2010
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
半导体器件的机械标准化 - 第6-20部分:表面贴装半导体器件封装外形图的一般规则 - 小型J型引线封装（Soj）封装尺寸测量方法
2010-08-30
BS 08/30190026 DC
BS EN 60191-6-20. Mechanical standardization of semiconductor devices. Part 6-20. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ)
英国标准EN 60191-6-20 半导体器件的机械标准化 第6-20部分 表面安装半导体器件封装外形图绘制的一般规则 小外形J形引线封装（SOJ）的封装尺寸测量方法
2008-12-01
DIN IEC 60191-6-20-DRAFT
Draft Document - Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 47D/732/CD:2008)
文件草案.半导体器件的机械标准化.第6-20部分:表面安装半导体器件封装外形图绘制的一般规则.小外形J引线封装（SOJ）的封装尺寸测量方法（IEC 47D/732/CD:2008）
2009-02-01
DIN EN 60191-6-20
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010); German version EN 60191-6-20:2010
半导体器件的机械标准化.第6-20部分:表面安装半导体器件封装外形图绘制的一般规则.小外形J引线封装（SOJ）封装尺寸的测量方法（IEC 60191-6-20-2010）；德文版EN 60191-6-2