电力半导体器件 型号编制方法
Type designation for power semiconductor device
1999-08-06
JB/T 4219-1999
电力半导体器件测试设备型号命名方法
Type designation of measuring equipments for power semiconductor devices
1999-08-06
GB/T 249-2017
半导体分立器件型号命名方法
The rule of type designation for discrete semiconductor devices
2017-05-12
JB/T 7786-1995
电力半导体器件检验抽样方法
Sampling method for test of power semiconductor devices
1995-10-05
IEC 60749-34-2010
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
半导体器件 - 机械和气候测试方法 - 第34部分:电力循环
2010-10-28
IEC 62969-2-2018
Semiconductor devices - Semiconductor interface for automotive vehicles - Part 2: Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors
半导体器件汽车半导体接口第2部分:汽车传感器共振无线电力传输效率评估方法
2018-03-08
IEC 60749-27-2006
Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
半导体器件 - 机械和气候测试方法 - 第27部分:静电放电(esd)灵敏度测试 - 机器型号(mm)
2006-07-18
GB/T 8446.2-2022
电力半导体器件用散热器 第2部分:热阻和流阻测量方法
Heat sinks for power semiconductor devices—Part 2: Measurement methods of thermal resistance and inlet-outlet fluid pressure drop
2022-03-09
IEC 60749-27-2006+AMD1-2012 CSV
Semiconductor devices - Mechanical and climatic test methods - Part
27: Electrostatic discharge (ESD) sensitivity testing - Machine
model (MM)
半导体器件.机械和气候试验方法.第1部分:
27:静电放电(ESD)灵敏度测试-机器
型号(毫米)