DESIGN REQUIREMENTS FOR PRINTED-WIRING ELECTRICAL BACKPLANE ASSEMBLIES (SUPERSEDING MIL-STD-2119)
印刷线路电气底板组件的设计要求（取代MIL-STD-2119）
1990-02-19
MIL MIL-C-28859B
CONNECTOR COMPONENT PARTS, ELECTRICAL BACKPLANE, PRINTED-WIRING, GENERAL SPECIFICATION FOR (SUPERSEDING MIL-C-28859A)
印刷线路电气背板连接器组件通用规范（代替MIL-C-28859A）
1990-01-19
BS IEC 61189-5-4-2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
电气材料、印制板和其他互连结构和组件的试验方法 材料和组件的一般试验方法 印制板组件用焊料合金、熔剂和非熔剂实心线
2015-01-31
BS EN 61189-5-4-2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies-General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
电气材料、印制板和其他互连结构和组件的试验方法 材料和组件的一般试验方法 印制板组件用焊料合金、熔剂和非熔剂实心线
2015-04-30
KS C IEC 61189-5-4
전기재료, 인쇄기판 및 다른 상호접속용 구조 및 조립품에 대한 시험방법 — 제5-4부: 재료 및 조립에 대한 일반 시험방법 — 인쇄기판 조립을 위한 솔더 합금과 플럭스 및 비플럭스 고체 와이어
电气材料、印制板和其他互连结构和组件的试验方法.第5-4部分:材料和组件的一般试验方法.印制板组件用焊料合金和助焊剂和非助焊剂实心线
2023-06-30
IEC 61189-5-4-2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
电气材料 印刷电路板和其他互连结构和组件的测试方法第5-4部分:材料和组件的一般测试方法 - 用于印刷电路板组件的焊料和助焊剂和无焊剂实心线
2015-01-08
DIN EN 61189-5-4
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies (IEC 61189-5-4:2015); German version EN 61189-5-4:2015
电气材料、印制板和其他互连结构和组件的试验方法.第5-4部分:材料和组件的一般试验方法.印制板组件用焊料合金、熔剂和非熔剂实心线（IEC 61189-5-4-2015）；德文版EN 61189-5-4: