BS EN 61192-2-2003
Workmanship requirements for soldered electronic assemblies-Surface-mount assemblies
焊接电子组件的工艺要求
2003-06-25
DIN EN 61192-2
Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies (IEC 61192-2:2003); German version EN 61192-2:2003
焊接电子组件的工艺要求.第2部分:表面安装组件（IEC 61192-2-2003）；德文版EN 61192-2:2003
2003-11-01
CID A-A-59550B
Fuse, Inclosed Link, Thin-Film, Surface Mount (SM), General Requirements for
表面安装（SM）薄膜封闭式熔断器的一般要求
2008-03-13
CID A-A-59532B
FUSE, INCLOSED LINK, SURFACE MOUNT (SM), GENERAL REQUIREMENTS FOR(SUPERSEDING A-A-59532A)
表面安装（SM）封闭式熔断器的一般要求（代替A-A-59532A）
2007-05-03
ETSI GS SMT 001
Surface Mount Technology (SMT); Requirements for Embedded Communication Modules For Machine To Machine Communications
表面贴装技术（SMT）；机器对机器通信用嵌入式通信模块的要求
2015-06-01
BS EN IEC 61191-1-2018
Printed board assemblies-Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
印制板组件
2018-11-13
GOST R IEC 61191-1-2017
Печатные узлы. Часть 1. Поверхностный монтаж и связанные с ним технологии. Общие технические требования
印制板组件 第一部分 表面安装和相关组装技术 总规范
CID A-A-55519E
FUSE, INCLOSED LINK, SUBMINIATURE, SURFACE MOUNT (SM), GENERAL REQUIREMENTS FOR(SUPERSEDING A-A-55519B)
表面安装（SM）超小型封闭式熔断器的一般要求（替代A-A-55519B）
2017-06-01
KS C IEC 61191-1(2016 Confirm)
인쇄기판 조립품－제1부：품목규격：표면실장 및 관련 조립기술을 이용하여 납땜된 전기전자 조립품에 대한 요구사항
印制板组件第1部分:总规范采用表面安装和相关组装技术的焊接电气和电子组件的要求
2006-12-18
KS C IEC 61191-1
인쇄회로기판 조립품 —제1부: 일반규격 — 표면실장 및 관련 실장기술을 이용하여 솔더링한 전기전자 조립품에 대한 요구사항
印制板组件.第1部分:总规范.使用表面安装和相关组装技术的焊接电气和电子组件的要求
2021-10-19
GB/T 19247.1-2003
印制板组装 第1部分:通用规范 采用表面安装和相关组装技术的电子和电气焊接组装的要求
Printed board assemblies--Part 1: Generic specification--Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
2003-07-02
IEC 61191-1-2018
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
印制板组件第1部分:总规范.使用表面安装和相关组装技术的焊接电气和电子组件的要求
2018-09-14
IEC 61191-1-2018 RLV
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
印制板组件.第1部分:总规范.使用表面安装和相关组装技术的焊接电气和电子组件的要求
2018-09-14
CID A-A-55561B
FUSE, INCLUSED LINK, DUAL-INLINE PACKAGE (DIP), OR SURFACE MOUNT (SM), GENERAL REQUIREMENTS FOR (SUPERSEDING A-A-55561A)
双列直插式组件（DIP）或表面安装（SM）保险丝 包括链路 通用要求（替代A-A-55561A）
2005-04-05
BS 11/30255124 DC
BS EN 61191-1. Printed board assemblies. Part 1. Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
BS EN 61191-1 印制板组件 第一部分 通用规范 使用表面安装和相关组装技术的焊接电气和电子组件的要求
2011-11-01
CID A-A-59533A
FUSEHOLDER, BLOCK, 5 AMPERE (A), 125 VOLTS (V) AC/DC, SURFACE MOUNT (SM), GENERAL REQUIREMENTS FOR(SUPERSEDING A-A-59533)
表面贴装（SM）5安培（A）、125伏（V）AC/DC块式熔断器的一般要求（代替A-A-59533）
2006-07-19
DIN EN IEC 61191-1
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2018); German version EN IEC 61191-1:2018
印制板组件.第1部分:总规范.使用表面安装和相关组装技术的焊接电气和电子组件的要求（IEC 61191-1-2018）；德文版EN IEC 61191-1:2018
2019-06-01
BS EN IEC 61188-6-4-2019
Printed boards and printed board assemblies. Design and use-Land pattern design. Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
印制板和印制板组件 设计和使用
2019-07-12
IEC 61188-6-4-2019
Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
印制板和印制板组件.设计和使用.第6-4部分:版图设计.从版图设计的角度看表面安装组件（SMD）尺寸图的一般要求
2019-05-02
DIN EN IEC 61188-6-4
Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design (IEC 61188-6-4:2019); German version EN IEC 61188-6-4:2019
印制板和印制板组件.设计和使用.第6-4部分:接地图案设计.从接地图案设计的角度看表面安装组件（SMD）尺寸图的一般要求（IEC 61188-6-4-2019）；德文版EN IEC 61188-6-4:2019
2020-04-01