GOST 26118-1984
Преобразователи электроэнергии полупроводниковые мощностью 5 кВ·А и выше. Маркировка, упаковка, транспортирование и хранение
功率为5 kV·A及以上的电能半导体转换器 标记 包装 运输和储存
GB/T 35010.3-2018
半导体芯片产品 第3部分：操作、包装和贮存指南
Semiconductor die products—Part 3: Guide for handling, packing and storage
2018-03-15
JB/T 10501-2005
电力半导体器件用管壳瓷件
Ceramic parts of case for power semiconductor devices
2005-03-19
IEC 60747-15-2024
Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices
半导体器件第15部分:分立器件隔离功率半导体器件
2024-10-22
IEC 60747-15-2024 RLV
Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices
半导体器件第15部分:分立器件隔离功率半导体器件
2024-10-22
IEC TR 62258-3-2010
Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
半导体模具产品.第3部分:搬运、包装和储存的良好实践建议
2010-08-06
IEC 60749-34-1-2025
Semiconductor devices - Mechanical and climatic test methods - Part 34-1: Power cycling test for power semiconductor module
半导体器件 机械和气候试验方法 第34-1部分:功率半导体模块的功率循环试验
2025-06-20
GB/T 8446.1-2022
电力半导体器件用散热器 第1部分：散热体
Heat sinks for power semiconductor devices—Part 1: Radiators
2022-03-09
IEC 63244-1-2021
Semiconductor devices - Semiconductor devices for wireless power transfer and charging - Part 1: General requirements and specifications
半导体器件.无线功率传输和充电用半导体器件.第1部分:一般要求和规范
2021-09-14
MIL MIL-F-48753 Notice 1-Validation 1
Fuze, M509A1, Power Supply for and Grounding Sleeve Assembly for, Parts for, Assembling and Packing
引信 M509A1 电源和接地套管组件 零件 组装和包装
2018-07-16
MIL MIL-F-48753
Fuze, M509A1, Power Supply for and Grounding Sleeve Assembly for, Parts for, Assembling and Packing
引信 M509A1 电源和接地套管组件 零件 组装和包装
1977-01-28
BS 07/30162213 DC
BS EN 60747-15. Semiconductor devices. Discrete devices Part 15. Isolated power semiconductor devices
英国标准EN 60747-15 半导体器件 分立器件第15部分 隔离功率半导体器件
2007-02-07
GB/T 8446.3-2022
电力半导体器件用散热器 第3部分：绝缘件和紧固件
Heat sinks for power semiconductor devices—Part 3: Insulators and fasteners
2022-03-09
IEC 62969-1-2017
Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors
半导体器件汽车半导体接口第1部分:汽车传感器电源接口的一般要求
2017-12-13
IEC 62830-2-2017
Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting
半导体器件 - 用于能量收集和生成的半导体器件 - 第2部分:基于热能的热电收获
2017-01-20
NB/T 20010.14-2010
压水堆核电厂阀门 第14部分:柔性石墨填料技术条件
PWR nuclear power plant valve—Part 14:Specification of flexible graphite packing
2010-05-24
UNE-EN 60749-34-2005
Semiconductor devices - Mechanical and climatic test methods -- Part 34: Power cycling
半导体器件机械和气候试验方法第34部分:功率循环
2005-03-16
KS C IEC 60749-34
반도체 소자－기계 및 기후적 환경 시험 방법－제34부：전력 사이클링
半导体器件机械和气候试验方法第34部分:功率循环
2017-05-30
SJ/T 2658.6-2015
半导体红外发射二极管测量方法 第6部分:辐射功率
Measuring method for semiconductor infrared-emitting diode - Part 6:Radiant power
2015-10-10
KS C IEC 60749-34(2022 Confirm)
반도체 소자－기계 및 기후적 환경 시험 방법－제34부：전력 사이클링
半导体器件机械和气候试验方法第34部分:功率循环
2017-05-30