BS 123300-003-2001
System of quality assessment. Capability detail specification. Rigid multilayer printed boards
质量评估体系 能力详细说明 刚性多层印制板
2001-12-17
BS 123800-003-2001
System of quality assessment. Capability detail specification. Flexible multilayer printed boards with through-connections
质量评估体系 能力详细说明 具有贯穿连接的挠性多层印制板
2001-12-17
DIN EN 123300-800
Capability detail specification: multilayer printed boards; german version EN 123300-800:1992
能力详细规范:多层印制板；德文版EN 123300-800:1992
1992-11-01
BS CECC 23300-003-1996
Harmonized system of quality assessment for electronic components. Capability detail specification: multilayer printed boards
电子元件质量评定协调体系 能力详细规范:多层印制板
1996-04-15
BS EN 62326-4-1-1997
Printed boards. Rigid multilayer printed boards with interlayer connections. Sectional specification-Capability detail specification. Performance levels, A, B and C
印制板 带有夹层连接的刚性多层印制板 分规范 能力详细说明 绩效等级A、B和C
1997-06-15
BS 123600-003-2001
System of quality assessment. Capability detail specification. Flex-rigid multilayer printed boards with through-connections
质量评估体系 能力详细说明 带贯穿连接的软硬多层印制板
2001-12-17
UNE 20621-6-1985
PRINTED BOARDS. SPECIFICATION FOR MULTILAYER PRINTED BOARDS
印制板 多层印制板规范
1985-10-15
UNE-EN 62326-4-1-1999
PRINTED BOARDS. PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION. SECTION 1: CAPABILITY DETAIL SPECIFICATION - PERFORMANCE LEVELS A, B, AND C
印制板 第4部分:带层间连接的刚性多层印制板.分规范 第1节:能力详细规范-性能等级A、B和C
1999-03-24
KS C IEC 62326-4-1(2016 Confirm)
인쇄회로기판－제4-1부：층간 배선된 경성 다층 인쇄회로기판－부분규격：성능수준 A, B, C
印制板第4部分:层间连接刚性多层印制板分规范第1节:性能详细规范性能等级A、B、C
2011-07-28
KS C IEC 62326-4-1(2021 Confirm)
인쇄회로기판－제4-1부：층간 배선된 경성 다층 인쇄회로기판－부분규격：성능수준 A, B, C
印制板第4部分:带层间连接的刚性多层印制板分规范第1节:性能详细规范性能等级A、B和C
2011-07-28
IEC 62326-4-1-1996
Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C
印刷电路板 - 第4部分:具有层间连接的刚性多层印刷电路板 - 分段规格 - 第1节:能力详细规格性能等级A B和C
1996-12-19
BS CECC 23800-801-1998
Harmonized system of quality assessment for electronic components. Capability detail specification: flexible multilayer printed boards with through connections
电子元件质量评定协调体系 能力详细规范:带贯穿连接的挠性多层印制板
1998-06-15
GOST IEC 62326-4-1-2013
Платы печатные. Част ь 4-1. Жесткие многослойные печатные платы с межслойными соединениями. Технические условия. Требования соответствия. Классы качества A, B, C
印刷板第4-1部分 具有层间连接的刚性多层印刷电路板 剖面规格 第1节能力细节规格 性能等级A B和C
2013-11-14
BS CECC 23600-801-1998
Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid multilayer printed boards with through connections
电子元件质量评定协调体系 能力详细规范:带贯穿连接的挠性-刚性多层印制板
1998-06-15
BS 6221-6-1982
Printed wiring boards-Specification for multilayer printed wiring boards
印刷线路板 多层印制线路板规范
1982-01-29
GB/T 4588.4-2017
刚性多层印制板分规范
Sectional specification--Multilayer printed boards
2017-07-31
QJ 831B-2011
航天用多层印制电路板通用规范
General specification for multilayer printed board for aerospace
2011-07-19
BS EN 62326-4-1997
Printed boards-Rigid multilayer printed boards with interlayer connections. Sectional specification
印制板 带有夹层连接的刚性多层印制板 分规范
1997-06-15
BS 6221-11-1991
Printed wiring boards-Specification for flex-rigid multilayer printed boards with through connections
印刷线路板 带贯穿连接的挠性-刚性多层印制板规范
1991-08-30
IPC 4101E-WAM1
Specification for Base Materials for Rigid and Multilayer Printed Boards
刚性和多层印制板用基材规范
2020-04-01