GB/T 20422-2018
无铅钎料
Lead-free solders
2018-05-14
ASM Sn-13
INDALLOY 227 - Lead-Free Solder
IND合金227-无铅焊料
1998-01-01
YS/T 747-2010
无铅锡基焊料
Lead-free tin-based solder
2010-11-22
SAE ARP6415
Use of Pb-Free Ball Grid Array Component Soldered Using SnPb Solder
SnPb焊料无铅球栅阵列元件的应用
2019-07-23
KS D 8545
수지 플럭스 코어 무연 연납
树脂药芯焊丝无铅焊料
2018-12-17
KS D 8545(2023 Confirm)
수지 플럭스 코어 무연 연납
树脂药芯无铅焊料
2018-12-17
SAE USCAR40-2
Lead-Free Solder Validation Test Plan
无铅焊接验证测试计划
2020-11-19
QB/T 4541-2013
免焊螺口式灯头 技术要求
Solder-free screw caps—Technical specification
2013-10-17
SME EE00-140
Parylene Conformal Coating Compatibility Evaluation With No-Clean Solder Pastes, Wave Solder Fluxes And Flux Cored Wire Solders
Parylene保形涂层与无清洁锡膏、波形焊剂和药芯焊丝焊料的相容性评估
2000-11-01
GOST 19746-2015
Проволока из припоев серебряных. Технические условия
电线从银焊料 规格
2015-02-27
JB/T 10845-2008
无铅再流焊接通用工艺规范
General technological specification for lead-free reflow soldering
2008-02-01
SJ/T 11697-2018
无铅元器件焊接工艺适应性规范
Applicability specification of soldering process for lead free component
2018-02-09
MIL MIL-S-46844C Notice 1-Inactivation
SOLDER BATH SOLDERING OF PRINTED WIRING ASSEMBLIES (S/S BY MIL-STD-2000)
印刷线路组合的焊缝焊接（MIL-STD-2000的S/S）
1989-09-08
DIN 57472-808
Testing of cables, wires and flexible cords; tinning, solderability and soldering shrinkage [VDE Specification]
电缆、电线和软线的测试；镀锡、可焊性和焊接收缩[VDE规范]
1984-02-01
DIN VDE 0472-808
Testing of cables, wires and flexible cords; tinning, solderability and soldering shrinkage [VDE Specification]
电缆、电线和软线的测试；镀锡、可焊性和焊接收缩[VDE规范]
1984-02-01
MIL MIL-S-46844C Notice 2-Cancellation
SOLDER BATH SOLDERING OF PRINTED WIRING ASSEMBLIES (S/S BY MIL-STD-2000)
印刷线路组件的焊槽钎焊（S/S BY MIL-STD-2000）
1995-02-27
MIL MIL-S-46844C
SOLDER BATH SOLDERING OF PRINTED WIRING ASSEMBLIES (S/S BY MIL-STD-2000)
印刷线路组件的锡槽焊接（MIL-STD-2000标准S/S）
1976-10-15
JIS Z 3198-7-2003
Test methods for lead-free solders -- Part 7: Methods for shear strength of solder joints on chip components
无铅焊料试验方法第7部分:芯片组件焊点剪切强度试验方法
2003-01-01
JIS Z 3198-5-2003
Test methods for lead-free solders -- Part 5: Methods for tensile tests and shear tests on solder joints
无铅焊料试验方法第5部分:焊点拉伸试验和剪切试验方法
2003-01-01
GB/T 4909.12-2009
裸电线试验方法 第12部分：镀层可焊性试验-焊球法
Test methods for bare wires - Part 12: Solderability test of coating - Solder globule method
2009-03-19