高可靠表面安装印制板组装件设计要求
Design requirements for high-reliability surface mount circuit assemblies
2011-07-19
IPC D-279
Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies
可靠表面安装技术印制板组件的设计指南
1996-08-01
BS EN IEC 61188-6-2-2021
Circuit boards and circuit board assemblies. Design and use-Land pattern design. Description of land pattern for the most common surface mounted components (SMD)
电路板和电路板组件 设计和使用
2021-03-19
KS C IEC 61188-6-2
회로기판 및 회로기판 조립품 — 설계 및 사용 — 제6-2부: 랜드 패턴 설계 — 가장 일반적인 표면실장부품(SMD)에 대한 랜드 패턴 설명
印制板和印制板组件.设计和使用.第6-2部分:焊盘图案设计.最常见表面安装组件（SMD）的焊盘图案说明
2025-01-31
IEC 61188-6-2-2021
Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
印制板和印制板组件.设计和使用.第6-2部分:焊盘图案设计.最常见表面安装组件（SMD）的焊盘图案说明